Showing all 7 results
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CuBrite™ PC-520
An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution. -
CUBRITE™ PC-525
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
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NPS™ 3000
A nitric acid based solution for stripping tin or tin/lead from printed circuit boards. NPS 3000 strips quickly and effectively, maintains a high loading capacity and leaves a clean copper surface for subsequent processes. For use in spray or soak applications.
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NPS™ 3001
A nitric acid based solution for stripping tin or tin/lead from printed circuit boards. NPS 3001 strips quickly and effectively, maintains a high loading capacity and leaves a clean copper surface for subsequent processes. For use in spray or soak applications.
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NPS™ 3002
A concentrated nitric acid based tin stripper with exceptional loading capacity, high strip speed, and resistance to exotherming. NPS 3002 is designed for use in high speed, steadystate, high volume applications. It leaves a bright copper surface for subsequent processes. NPS 3002 has a high tin holding capacity, greatly reducing re-deposition of tin oxide on equipment surfaces and in spray nozzles.
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NPS™10 & 20
A two step, high capacity alternative to peroxide tin/lead stripping. It is especially formulated for intermittent use in whole panel stripping. It can be used in either spray or soak applications without the worry of laminate attack or “run-away” peroxide reactions. NPS 10 is designed to remove the bulk of the tin/lead deposit safely, while leaving behind a thin intermetallic layer that protects the copper from chemical attack. NPS 20 removes the remaining intermetallic layer left after stripping in NPS 10. It works very quickly, with minimal copper attack, and will last 2-3 times as long as NPS 10.
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TinPlate™ PC-625
TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating of tin in
the application for SMOBC fabrication. TinPlate PC-625 is formulated to improve the
throwing power of the bath, aid in refining grain structure, and prevent treeing. It is added
based on amp hours and will increase limiting current density and control deposit
characteristics over a wide range of current densities. It produces a bright silver white
deposit. TinPlate PC-625 eliminates the need for lead and fluoborates used in
conventional etch resist plating processes. If an extra wetting agent is needed,
use TinPlate PC-625 Starter. Please consult your service representative for additions.
