Showing all 7 results
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ASPECT™
Organic Solderability Preservative Final Finish for Printed Circuit Boards. Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.
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Formance K™
Immersion Silver Final Finish for Printed Circuit Boards. Formance K has been developed to deposit pure, solderable silver layer on copper circuitry in compliance with IPC specification no. IPC-4553A. The deposit satisfies Class 3 final finish durability and is an excellent choice for demanding Pb-free assembly. Formance K is an easy to use product with simple analytical controls and straightforward replenishment that leads to lower running cost. Notably, the chemistry is EDTA- and alkylphenol ethoxylate-free and thus biodegradable.
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ME 515L
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
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QUANTUM ETCH™
A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM ETCH provides a superior microetch which can be used for inner layer processing, pre-plate cleaning, and cleaning prior to solder leveling. For pre-plate cleaning of panels plated with electroless copper, use the low etch rate operating conditions. QUANTUM ETCH produces a uniformly etched surface, and will maintain a constant desired etch rate over a broad solubility range of copper sulfate in the bath.
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SODIUM PERSULFATE
SODIUM PERSULFATE
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SUR CLEAN™ 92
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
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VERSAPREP™
VersaPrep is formulated to microetch multiple metallic surfaces and thus improve their processing including lamination, imaging and solder mask application. Microetching results in surfaces that are cleaner, with removed or reduced oxide and with higher roughness. These mechanisms occur to a different extent on different metals. VersaPrep is effective on aluminum, stainless steel, copper, copper alloys and selected other alloys such as Inconel. Different substrates can be treated with simple adjustments of concentration, temperature and contact time. VersaPrep can be used in either spray or soak mode.
