Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
SCREENSOL ER-250 is designed to remove emulsion and residue from printed circuit board imaging screens. SCREENSOL ER-250 is ready to use. This state-of-the-art product is fast acting, odorless, and non-corrosive. It replaced outdated bleaches and other toxic solvents.
TinPlateTMRTplates a dense, smooth Tin deposit onto various copper alloys, gold and other less noble metals, leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Since TinPlateTMRT deposits a brilliant finish, subsequent reflowing operations may be avoided. Since TinPlateTMRT s a chemical plating (rather than an “electro-plating”) bath, uniform plating can be expected on all surfaces, regardless of shape and size.