RBP Chemical Technology is a leader in adhesion promotion chemistry for printed circuit board manufacturing.
Browse the table below to learn more about our adhesion promotion chemicals.
|ULTRACLEAN™ NF||Non-Foaming Alkaline Spray Cleaner||Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …||adhesion-promotion copper-cleaning electronics-chemicals inner-layer-processing outer-layer-processing|
|PREPBOND™||Alkaline Cleaner for Resist Strip Residues||An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …||adhesion-promotion copper-cleaning electronics-chemicals inner-layer-processing outer-layer-processing|
|QUANTUM ETCH™||Stabilized Hydrogen Peroxide Solution||A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …||adhesion-promotion copper-cleaning electronics-chemicals hot-air-leveling inner-layer-processing microetchants outer-layer-processing fusing-leveling|
|MAGNABOND™ CO-300||Copper Oxide Process||A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …||adhesion-promotion copper-cleaning copper-oxide electronics-chemicals inner-layer-processing|
|MAGNABOND™ OxAlt||Oxide Alternative Adhesion Promoter||MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing …||adhesion-promotion copper-cleaning copper-oxide electronics-chemicals inner-layer-processing|