Adhesion Promotion


RBP Chemical Technology is a leader in adhesion promotion chemistry for printed circuit board manufacturing.

Browse the table below to learn more about our adhesion promotion chemicals.

ULTRACLEAN™ NFNon-Foaming Alkaline Spray CleanerFormulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …adhesion-promotion copper-cleaning electronics-chemicals inner-layer-processing outer-layer-processing
PREPBOND™Alkaline Cleaner for Resist Strip ResiduesAn alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …adhesion-promotion copper-cleaning electronics-chemicals inner-layer-processing outer-layer-processing
QUANTUM ETCH™Stabilized Hydrogen Peroxide SolutionA stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …adhesion-promotion copper-cleaning electronics-chemicals hot-air-leveling inner-layer-processing microetchants outer-layer-processing fusing-leveling
MAGNABOND™ CO-300Copper Oxide ProcessA copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …adhesion-promotion copper-cleaning copper-oxide electronics-chemicals inner-layer-processing
MAGNABOND™ OxAltOxide Alternative Adhesion PromoterMAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing …adhesion-promotion copper-cleaning copper-oxide electronics-chemicals inner-layer-processing