We firmly believe that chemistry provides the perfect solutions to polish, passivate, deoxidize and coat medical implant devices. And while these chemicals are made to help, they can also do a lot a harm if misused or mistreated.
Hazardous communications are the most important part of chemistry in any industry, but it’s especially important in the Medical Implant Device industry.
Southern Lithoplate’s (SLP) Strategic Alliance, formed in 2006, continues to grow and evolve with new partners that enhance the organization’s advantages for US printers seeking affordable, quality consumables and services in a single-call/single source format. RBP Chemical Technology Inc., is the newest partner to join the trendsetting Alliance, SLP announced this week
One of the main causes of plating defects is copper peeling. Copper peeling is really a disconcerting situation. If it happens, you’ve already put a lot of money, time, and effort to fabricate the circuit board up to this point as you come out of your electrolytic, or electroless copper, plating process. This becomes disconcerting because you may find out that the plated copper peels from either the laminate surface or from the electrical surface. Of course at that point, it’s very difficult to rework the board, and most likely that board at this time will be most likely scrapped.
Are all OSPs the same? And how does an OSP actually protect the copper base?
RBP Chemical Technology is pleased to announce the release of another innovation in its proprietary portfolio of engineered processes for the cleaning, deoxidation and polishing of titanium and titanium alloys. The ElectroPolish 2152 is a non-aqueous, sub-room temperature electropolishing solution designed to yield a superior surface finish and has been shown to provide a uniformly polished surface with minimal metal removal. Use of the Electropolish 2152 enhances the corrosion resistance and thus the biocompatibility of the embedded medical device.
Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards. The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.
RBP is proud to announce the release of MAGNUM N-499, an additional innovation to their PTH process product offering for printed circuit boards. MAGNUM N-499 is a specially designed neutralizer based on hydrogen peroxide that removes residues of manganese dioxide from drilled holes after permanganate desmear in preparation for metallization of multilayer circuit boards. MAGNUM N-499 is effective on a variety of resin materials including high performance epoxy resins and polyimide. It is easily replenished and does not require circuit boards to be dried prior to processing. MAGNUM N-499 should be used in conjunction with MAGNUM K-401 OXIDIZER or MAGNUM N-501 OXIDIZER for optimal performance in the desmear sequence.
RBP’s VP of Technology and Business Development, Mike Carano, recently sat down with John Johnson of Averatek and Nolan Johnson of I-Connect007 to discuss RBP’s new distribution agreement with Averatek. RBP recently announced that we would be supplying the supporting chemicals for Averatek’s A-SAP™ plating process. Click on the video below to hear the full discussion on this new distribution agreement.
Averatek Corporation is proud to announce that RBP Chemical Technology will become a new distribution partner. RBP will supply supporting chemistries that are needed by licensees of Averatek’s A-SAP™ process. The core LMI™ (Liquid Metal Ink) chemistry will continue to be supplied directly by Averatek. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next generation electronics.