RBP’s Vice President of Business Development and Technology, Mike Carano, was recently selected as a recipient for the Dieter Bergman IPC Fellowship Award at the 2020 IPC APEX EXPO. According to IPC, The Dieter Bergman IPC Fellowship Award is given to those “who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry.”
Liquid Gold™ Zero is an environmentally friendly, VOC-free fountain solution for coldset printing applications. Liquid Gold™ Zero is formulated in both a mild acid and a neutral version. This product is a California VOC-compliant proprietary blend formulated specifically for processless plates, but will work on all plates. In addition, proper use of the Liquid Gold™ Zero has been proven to minimize hot and cold startup waste.
RBP Chemical Technology, Inc. has named Ernest Litynski as President effective immediately. Litynski, a graduate of the US Military Academy at West Point, earned a Bachelor of Science (B.S.) in Environmental Engineering. He holds a Master of Science (M.S.) in Engineering Management and a Master of Business Administration (MBA) from Marquette University in Milwaukee. Finally, Ernie also holds a Master of Science (M.S.) in Strategic Studies from the United States Army War College. He is a certified Lean Six Sigma Black Belt and teaches Lean Six Sigma courses for numerous customers and industry associations.
Let’s talk about hot air leveling, and of course, lead-free hot air leveling. If you’ve spent time in Asia and Europe, you’ll notice that in North America, the final finish market is still significantly different than it is in Asia and in Europe. Particularly in Asia, where they have moved away significantly from hot air leveling. Less than three percent of circuit boards made in Asia now use hot air solder leveling, or even lead-free hot air solder leveling. Whereas in North America, we’re still seeing a good portion, 35 to 40 percent of the circuit boards, using some type of hot air leveling, whether it be lead-free or lead based. Why is that? Hot air leveling has many advantages and disadvantages. Below we will highlight some of these advantages and disadvantages.
RBP Chemical Technology is pleased to introduce another key waste treatment product to serve the metal finishing, electronics and photochemical milling industries. MetalTreat Chelate Eliminator-8 is formulated to eliminate waste of very highly chelated waste streams containing heavy metals.
RBP Chemical Technology, the leaders in formulated and engineered processes for the medical device manufacturing industry, is proud to introduce CoCr Electropolish. This development is another innovation in RBP’s portfolio of cleaners, deoxidants and electropolishes/chemical polishes for metal based medical implants. Well recognized by major medical device companies, RBP Chemical Technology brings over 25 years’ experience in providing customized solutions for the corrosion protection and passivation of implantable medical devices.
MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide and is replenishable. MAGNUM S-450 does not require circuit boards to be dried prior to processing.
When it comes to electropolishing Nitinol, it’s important to know how to electropolish Nitinol at room temperature compared to electropolishing Nitinol at very low temperatures. Here are some things to keep in mind when electropolishing Nitinol at different temperatures.
Etchback and desmear serve many purposes. The first purpose of etchback is to assure the copper is clean. Assuring the copper is clean will then help form a metallurgical bond with the plating. The last purpose of etchback is to form a three-point contact around the inner layer. Why are each of these processes so important? Below we will go in more depth as to how each process effects the overall goal of etchback.