News and Events

May 8, 2020

Video: RBP and Averatek Discuss New Distribution Agreement

RBP’s VP of Technology and Business Development, Mike Carano, recently sat down with John Johnson of Averatek and Nolan Johnson of I-Connect007 to discuss RBP’s new distribution agreement with Averatek. RBP recently announced that we would be supplying the supporting chemicals for Averatek’s A-SAP™ plating process. Click on the video below to hear the full discussion on this new distribution agreement.

April 21, 2020

Averatek and RBP Announce New Distribution Agreement

Averatek Corporation is proud to announce that RBP Chemical Technology will become a new distribution partner. RBP will supply supporting chemistries that are needed by licensees of Averatek’s A-SAP™ process. The core LMI™ (Liquid Metal Ink) chemistry will continue to be supplied directly by Averatek. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next generation electronics.

April 14, 2020

DT-600 All Purpose Cleaner Available for Cleaning Needs

The state of Wisconsin’s “Safer at Home” order of March 25 has shut down “non essential business,” but our manufacturing plant is exempt. We maintain critical supplier status as we serve the electronic, medical device, graphic arts, and military industries. Part of this includes manufacturing cleaning solutions, like DT-600

As manufacturers of isopropanol & ethanol reallocate supply to support the medical, healthcare, and disinfectant industries, RBP Chemical Technology would like to offer another solution. Our DT-600 is an All-Purpose concentrate cleaner that can be used on a variety of surface types. This versatile and dilutable cleaner can tackle different cleaning jobs, meaning you only have to carry one product to conduct multiple cleaning processes. This product is environmentally friendly, and low odor with zero VOC’s.

March 26, 2020

RBP COVID-19 Update

Dear Valued Partner:

March 11, 2020

Announcing the Release of ONYX™ Direct Metallization System for PCBs

ONYX™ is a Direct Metallization System for High Reliability and Complex Printed Circuit Boards

March 4, 2020

RBP’s President Featured in New Interview

RBP President, Ernie Litynski, recently sat down for an interview with Dick Crowe of the  “Real Time With…” series while attending this year’s IPC APEX Expo. In the interview Ernie shares his background, his hopes for his new role as RBP’s President and his hopes for the company. Click on the image below to watch.

February 14, 2020

RBP’s Mike Carano Selected as Recipient of Dieter Bergman IPC Fellowship Award

RBP’s Vice President of Business Development and Technology, Mike Carano, was recently selected as a recipient for the Dieter Bergman IPC Fellowship Award at the 2020 IPC APEX EXPO. According to IPC, The Dieter Bergman IPC Fellowship Award is given to those “who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry.”

February 5, 2020

RBP Announces Latest Innovation in Printing Industry: Liquid Gold™ Zero

Liquid Gold™ Zero is an environmentally friendly, VOC-free fountain solution for coldset printing applications. Liquid Gold™ Zero is formulated in both a mild acid and a neutral version. This product is a California VOC-compliant proprietary blend formulated specifically for processless plates, but will work on all plates. In addition, proper use of the Liquid Gold™ Zero has been proven to minimize hot and cold startup waste.

January 30, 2020
Portrait of Ernie Litynski

RBP is Pleased to Announce Appointment of New President

Portrait of Ernie LitynskiRBP Chemical Technology, Inc. has named Ernest Litynski as President effective immediately. Litynski, a graduate of the US Military Academy at West Point, earned a Bachelor of Science (B.S.) in Environmental Engineering.  He holds a Master of Science (M.S.) in Engineering Management and a Master of Business Administration (MBA) from Marquette University in Milwaukee. Finally, Ernie also holds a Master of Science (M.S.) in Strategic Studies from the United States Army War College.  He is a certified Lean Six Sigma Black Belt and teaches Lean Six Sigma courses for numerous customers and industry associations.

December 9, 2019

Advantages and Disadvantages of Hot Air Leveling

Let’s talk about hot air leveling, and of course, lead-free hot air leveling. If you’ve spent time in Asia and Europe, you’ll notice that in North America, the final finish market is still significantly different than it is in Asia and in Europe. Particularly in Asia, where they have moved away significantly from hot air leveling. Less than three percent of circuit boards made in Asia now use hot air solder leveling, or even lead-free hot air solder leveling. Whereas in North America, we’re still seeing a good portion, 35 to 40 percent of the circuit boards, using some type of hot air leveling, whether it be lead-free or lead based. Why is that? Hot air leveling has many advantages and disadvantages. Below we will highlight some of these advantages and disadvantages.