News and Events

October 12, 2021

RBP Chemical Technology Appoints New Executive Vice President

Dan Carey, Executive Vice PresidentRBP Chemical Technology, Inc. is adding to its leadership team with the appointment of Dan Carey as Executive Vice President.

October 7, 2021

6 Solutions for Safer Chemistry Handling

We take pride in is our core competency, and that’s being experts in surface chemistry. We understand the function of cause and effect of chemistry with all mediums, from printing press room, all the way to medical chemistry. When you use a press room, as an example, you’re touching many different surfaces. You’re touching everything from organic items like paper to aluminum plates and carbons. You’re also touching hydrocarbon substrates like plastics, all the way to using other chemistries, like ink.  When it comes to chemistry handling, and we want you to do it safely. Here are our six solutions for safer chemistry handling.

April 30, 2021

The four focus points of process safety

We firmly believe that chemistry provides the perfect solutions to polish, passivate, deoxidize and coat medical implant devices. And while these chemicals are made to help, they can also do a lot a harm if misused or mistreated.

April 12, 2021

What is your HAZCOM Plan?

Hazardous communications are the most important part of chemistry in any industry, but it’s especially important in the Medical Implant Device industry.

December 8, 2020

RBP Partners with Southern Lithoplate Strategic Alliance to Ramp Up Products and Savings for America’s Newspapers

Southern Lithoplate’s (SLP) Strategic Alliance, formed in 2006, continues to grow and evolve with new partners that enhance the organization’s advantages for US printers seeking affordable, quality consumables and services in a single-call/single source format. RBP Chemical Technology Inc., is the newest partner to join the trendsetting Alliance, SLP announced this week

November 16, 2020

Causes of Plating Defects: Copper Peeling

One of the main causes of plating defects is copper peeling. Copper peeling is really a disconcerting situation. If it happens, you’ve already put a lot of money, time, and effort to fabricate the circuit board up to this point as you come out of your electrolytic, or electroless copper, plating process. This becomes disconcerting because you may find out that the plated copper peels from either the laminate surface or from the electrical surface. Of course at that point, it’s very difficult to rework the board, and most likely that board at this time will be most likely scrapped.

August 26, 2020

Quick Overview of Organic Solderability Preservatives (OSPs)

Are all OSPs the same? And how does an OSP actually protect the copper base?

August 18, 2020

Announcing the Release of Electropolish 2152 for Nitinol and Titanium Based Embedded Medical Devices

RBP Chemical Technology is pleased to announce the release of another innovation in its proprietary portfolio of engineered processes for the cleaning, deoxidation and polishing of titanium and titanium alloys. The ElectroPolish 2152 is a non-aqueous, sub-room temperature electropolishing solution designed to yield a superior surface finish and has been shown to provide a uniformly polished surface with minimal metal removal.  Use of the Electropolish 2152 enhances the corrosion resistance and thus the biocompatibility of the embedded medical device.

July 29, 2020

Announcing the Release of Circutek CC-720™ PTH Acid Cleaner Conditioner

Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards. The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.

July 15, 2020

RBP Chemical Technology Announces the Release of MAGNUM N-499 for PCBs

RBP is proud to announce the release of MAGNUM N-499, an additional innovation to their PTH process product offering for printed circuit boards. MAGNUM N-499 is a specially designed neutralizer based on hydrogen peroxide that removes residues of manganese dioxide from drilled holes after permanganate desmear in preparation for metallization of multilayer circuit boards.  MAGNUM N-499 is effective on a variety of resin materials including high performance epoxy resins and polyimide.  It is easily replenished and does not require circuit boards to be dried prior to processing.  MAGNUM N-499 should be used in conjunction with MAGNUM K-401 OXIDIZER or MAGNUM N-501 OXIDIZER for optimal performance in the desmear sequence.