Electronics Chemistry

November 11, 2019

What You Should Know About MAGNUM S-450 Multilayer Hole Conditioner

MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide and is replenishable. MAGNUM S-450 does not require circuit boards to be dried prior to processing.

September 9, 2019

VersaPrep: What To Know About this New Product

VersaPrep is a specialty formulated product designed to clean and microetch a wide variety of metallic substrates. It is particularly useful in removing metallic oxides and providing a micro-roughened surface to enhance dry film adhesion as well as adhesion of other materials to the surface of the metal. VersaPrep easily deoxidizes and micro-etches copper, copper alloys, stainless steel, aluminum and Inconel.

July 29, 2019

Equipment Cleaner IV: Why Printed Circuit Board Customers Will Be Pleased with this New Product

RBP Chemical Technology is pleased to announce the release of Equipment Cleaner IV. Equipment Cleaner IV removes water hardness residues, photoresist scum and metal salt deposits from chemical processing equipment. The new process is specifically developed for the printed circuit board industry and is very useful for spray equipment. It causes no damage to metal or plastic parts and is completely odorless, making it the ideal process for printed circuit boards.

May 29, 2019

RBP Chemical Technology Announces the Introduction of LDI Strip 77 Fine-Line Photoresist Stripper

LDI Strip 77 a semi-aqueous photoresist stripper formulated for stripping very fine line and high density printed circuit boards. With properly controlled plating, LDI Strip 77 effectively produces particles 2 mil in diameter and smaller, greatly facilitating filtration. LDI Strip 77 provides complete resist removal with standard Dry Film and LDI Dry film. LDI Strip 77 contains a specially formulated additive package that protects metal surfaces against corrosion, including copper and tin. In addition the LDI 77 Strip enables ease of inspection at outerlayer AOI. LDI Strip 77 can be used in both spray and immersion applications. Working concentration of the LDI Strip 77 will vary based on customer specific processing requirements.

April 2, 2019

IPC Webinar on Technology Trends 2018

Watch Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, discuss technology trends related to PCB fabrication and where the electronics manufacturing industry is headed. You can download the slides from this presentation in PDF format here.

March 12, 2019

Metalization of High Performance Resin Materials with a Graphite-Based Direct Plating System

Abstract by Michael Carano

August 24, 2018

Working with Flexible Circuits

Flexible circuits were first introduced as a replacement for wire harnesses. The earliest versions date back to World War II. Today, flex and rigid flex circuits are filling an important role across multiple industries, include applications in the medical, automotive, and telecom fields.

August 17, 2018

The Importance of Surface Preparation

Today we are being asked by OEMs, particularly in the high-frequency space, for ways to minimize the amount of surface roughness to provide for enhanced electrical properties. Of course, when you minimize roughness you also run the risk of compromising the optimum adhesion of the smoothed material – especially if you don’t do any surface prep.

July 24, 2018

What Can Go Wrong with Lamination?

A beautifully registered multi-layer board, with nice drilled holes, level copper plating, and no evidence of separation. This is what we strive for in the manufacturing of printed circuit boards.

July 24, 2018

Video: Surface Finishes on Printed Circuit Boards with Mike Carano

What finish should I use for my PCB Design? There’s no one single answer, it depends.