Electronics Chemistry
December 23, 2021
Toll Blending is a common service for chemical companies (e.g.: “toll blender”) to manufacture/fulfill chemistry blending for a partner in order to reduce the partner’s production risks or capital investments. RBP Chemical Technology works with partners around the globe to provide this service, as well as, to optimize their chemical processes. Here are six reasons why customers turn to RBP for their toll blending needs.
December 21, 2021
When companies have specific chemical needs but lack the resources to address these needs in house, outsourced chemical blending – or Toll Blending – is a valuable solution.
November 16, 2020
One of the main causes of plating defects is copper peeling. Copper peeling is really a disconcerting situation. If it happens, you’ve already put a lot of money, time, and effort to fabricate the circuit board up to this point as you come out of your electrolytic, or electroless copper, plating process. This becomes disconcerting because you may find out that the plated copper peels from either the laminate surface or from the electrical surface. Of course at that point, it’s very difficult to rework the board, and most likely that board at this time will be most likely scrapped.
August 26, 2020
Are all OSPs the same? And how does an OSP actually protect the copper base?
July 29, 2020
Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards. The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.
July 15, 2020
RBP is proud to announce the release of MAGNUM N-499, an additional innovation to their PTH process product offering for printed circuit boards. MAGNUM N-499 is a specially designed neutralizer based on hydrogen peroxide that removes residues of manganese dioxide from drilled holes after permanganate desmear in preparation for metallization of multilayer circuit boards. MAGNUM N-499 is effective on a variety of resin materials including high performance epoxy resins and polyimide. It is easily replenished and does not require circuit boards to be dried prior to processing. MAGNUM N-499 should be used in conjunction with MAGNUM K-401 OXIDIZER or MAGNUM N-501 OXIDIZER for optimal performance in the desmear sequence.
May 8, 2020
RBP’s VP of Technology and Business Development, Mike Carano, recently sat down with John Johnson of Averatek and Nolan Johnson of I-Connect007 to discuss RBP’s new distribution agreement with Averatek. RBP recently announced that we would be supplying the supporting chemicals for Averatek’s A-SAP™ plating process. Click on the video below to hear the full discussion on this new distribution agreement.
April 21, 2020
Averatek Corporation is proud to announce that RBP Chemical Technology will become a new distribution partner. RBP will supply supporting chemistries that are needed by licensees of Averatek’s A-SAP™ process. The core LMI™ (Liquid Metal Ink) chemistry will continue to be supplied directly by Averatek. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next generation electronics.
March 11, 2020
ONYX™ is a Direct Metallization System for High Reliability and Complex Printed Circuit Boards
March 4, 2020
RBP President, Ernie Litynski, recently sat down for an interview with Dick Crowe of the “Real Time With…” series while attending this year’s IPC APEX Expo. In the interview Ernie shares his background, his hopes for his new role as RBP’s President and his hopes for the company. Click on the image below to watch.