Electronics Chemistry

May 8, 2020

Video: RBP and Averatek Discuss New Distribution Agreement

RBP’s VP of Technology and Business Development, Mike Carano, recently sat down with John Johnson of Averatek and Nolan Johnson of I-Connect007 to discuss RBP’s new distribution agreement with Averatek. RBP recently announced that we would be supplying the supporting chemicals for Averatek’s A-SAP™ plating process. Click on the video below to hear the full discussion on this new distribution agreement.

April 21, 2020

Averatek and RBP Announce New Distribution Agreement

Averatek Corporation is proud to announce that RBP Chemical Technology will become a new distribution partner. RBP will supply supporting chemistries that are needed by licensees of Averatek’s A-SAP™ process. The core LMI™ (Liquid Metal Ink) chemistry will continue to be supplied directly by Averatek. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next generation electronics.

March 11, 2020

Announcing the Release of ONYX™ Direct Metallization System for PCBs

ONYX™ is a Direct Metallization System for High Reliability and Complex Printed Circuit Boards

March 4, 2020

RBP’s President Featured in New Interview

RBP President, Ernie Litynski, recently sat down for an interview with Dick Crowe of the  “Real Time With…” series while attending this year’s IPC APEX Expo. In the interview Ernie shares his background, his hopes for his new role as RBP’s President and his hopes for the company. Click on the image below to watch.

February 14, 2020

RBP’s Mike Carano Selected as Recipient of Dieter Bergman IPC Fellowship Award

RBP’s Vice President of Business Development and Technology, Mike Carano, was recently selected as a recipient for the Dieter Bergman IPC Fellowship Award at the 2020 IPC APEX EXPO. According to IPC, The Dieter Bergman IPC Fellowship Award is given to those “who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry.”

December 3, 2019

RBP Appoints IEC Exclusive Distributor in North America for PCB Materials

RBP Chemical Technology (RBP), located in Milwaukee, Wisconsin, has named International Electronic Components (IEC) its exclusive distributor for PCB materials in North America.

December 2, 2019

Announcing the Release of MetalTreat Chelate Eliminator-8

RBP Chemical Technology is pleased to introduce another key waste treatment product to serve the metal finishing, electronics and photochemical milling industries. MetalTreat Chelate Eliminator-8 is formulated to eliminate waste of very highly chelated waste streams containing heavy metals.

November 11, 2019

What You Should Know About MAGNUM S-450 Multilayer Hole Conditioner

MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide and is replenishable. MAGNUM S-450 does not require circuit boards to be dried prior to processing.

September 9, 2019

VersaPrep: What To Know About this New Product

 VersaPrep is a specialty formulated product designed to clean and microetch a wide variety of metallic substrates. It is particularly useful in removing metallic oxides and providing a micro-roughened surface to enhance dry film adhesion as well as adhesion of other materials to the surface of the metal. VersaPrep easily deoxidizes and micro-etches copper, copper alloys, stainless steel, aluminum and Inconel.

July 29, 2019

Equipment Cleaner IV: Why Printed Circuit Board Customers Will Be Pleased with this New Product

RBP Chemical Technology is pleased to announce the release of Equipment Cleaner IV. Equipment Cleaner IV removes water hardness residues, photoresist scum and metal salt deposits from chemical processing equipment. The new process is specifically developed for the printed circuit board industry and is very useful for spray equipment. It causes no damage to metal or plastic parts and is completely odorless, making it the ideal process for printed circuit boards.