RBP Chemical Technology is a leader in developing chemistry for PCB fabrication and supplying leading electronics manufacturers worldwide.
Browse the table below to learn more about our chemicals for printed circuit board fabrication including through-hole plating chemistry and other specialized applications.
Step One: Copper Cleaning
Copper Cleaners
| Product | Description |
|---|---|
| FinClean RS | Final Finish Acid Cleaner |
| FinClean CR | Final Finish Acid Cleaner |
| VersaClean | Metal Surface Cleaner for Electronics |
| Accuclean NF | Acid cleaner for spray applications |
| Posiclean™ MR | Acid cleaner for soak applications |
| Circutek™ ME-515 | Microetchant for copper |
| Ultraclean™ NF | Alkaline cleaner for spray applications |
| PrepBond™ | Alkaline cleaner |
| Posiclean™ M | Acid cleaner for soak applications |
| Layer Clean™ CR | Acid cleaner for spray applications |
| Layer Clean™ NP | Acid cleaner for spray applications |
Step Two: Developing
Developers
| Product | Description |
|---|---|
| ADC-40 | Developer concentrate |
| DX™45 HW | Aqueous Developer Concentrate for Hard Water |
| DX™45 NH | Aqueous Developer Concentrate |
| DX™45 Plus | Enhanced Developer Replenisher |
Step Three: Developing
PCB Antifoams
| Product | Description |
|---|---|
| Defoamer AR™ (RDZ-1969) | Developer Antifoam |
| FoamFREE™ One | Aqueous Developer/Stripper Antifoam |
| Defoamer FE™ | Fully organic non-Silicone water-soluble defoamer |
| AntiFoam BB ™ | Highly Concentrated Antifoam |
Equipment Cleaners
| Product | Description |
|---|---|
| Citrisump | Acidic equipment cleaner |
| Equipment Cleaner IV | Equipment cleaner |
| Tidy Sump | Equipment Cleaner |
| Sump Pro | Non-chelating, acidic equipment cleaner |
| Sump Doctor™ | Cleans resist developing and stripping machines |
| TidyLine™ EQ-100 | Cleans conveyorized processing equipment |
| E-clean DF | Acidic, solvent-based, soluble equipment cleaner |
| Equipment Cleaner II™ | Equipment cleaner |
| Cupric Etching Equipment Cleaner | Cupric Etching Equipment Cleaner |
Step Four: Inner Layer Etching
Inner Layer Etching
| Product | Description |
|---|---|
| Hydrochloric Acid 20 Be | Etching Solution |
| Sodium Chlorate 46% | Etch Replenisher |
Step Five: Inner Layer Resist Strip
Photoresist Strippers
| Product | Description |
|---|---|
| ADF-72 | Aqueous Resist Stripper |
| ADF-55 | Dry Film and Liquid Resist Stripper |
| Dual Strip™ BAT | Resist and Ink Stripper |
| DX™ Strip BAT | Resist and Ink Stripper |
Step Six: Lamination
Lamination
| Product | Description |
|---|---|
| MagnaBond™ 400 | Copper Surface Prep |
| Ultraclean™ NF | Alkaline cleaner for spray applications |
| PrepBond™ | Alkaline cleaner |
| Quantum Etch™ | Microetchant for copper |
| MagnaBond™ CO-300 | Copper Oxide Process |
Step Seven: Desmear
PTH Desmear
| Product | Description |
|---|---|
| Magnum N-499 Peroxide | Oxidizer for Neutralizer Magnum N-499 |
| Magnum N-499 | Neutralizer for Permanganate PTH Desmear |
| Magnum™ GE-600 | Glass Etch |
| Magnum™ K-401 Oxidizer | Permanganate desmear |
| Magnum™ N-501 Oxidizer | Permanganate desmear |
| Magnum™ N-599 | Neutralizer for permanganate desmear |
| Magnum™ S-400 | Sweller |
| Magnum™ S-450 | Sweller |
Step Eight: Metallization
PTH Metalization
| Product | Description |
|---|---|
| Circutek EC-807 | PTH Metallization Electroless Copper |
| Circutek C-877 | Non-metallic Surface Catalyst |
| Circutek CC-720 | Cleaner/Conditioner for Electroless Copper |
| Circutek CC-710 | Conditioner for ElCu |
| Circutek C-777 | Catalyst for ElCu |
| Circutek A-778 | Accelerator for ElCu |
| Circutek PC-701 | Electroless copper process |
| Circutek PD-776 | Predip for ElCu catalyst |
| Circutek PC-801 | Electroless copper process |
| Onyx | Graphite Based Direct Metallization |
| Circutek™ ME-515 | Microetchant for copper |
Antitarnish
| Product | Description |
|---|---|
| AT-2000 | Alkaline Oxidation Inhibitor Concentration |
| AT-3000 | Concentrated antitarnish compound |
Step Nine: Outer Layer
Copper Cleaners
| Product | Description |
|---|---|
| FinClean RS | Final Finish Acid Cleaner |
| FinClean CR | Final Finish Acid Cleaner |
| VersaClean | Metal Surface Cleaner for Electronics |
| Accuclean NF | Acid cleaner for spray applications |
| Posiclean™ MR | Acid cleaner for soak applications |
| Circutek™ ME-515 | Microetchant for copper |
| Ultraclean™ NF | Alkaline cleaner for spray applications |
| PrepBond™ | Alkaline cleaner |
| Posiclean™ M | Acid cleaner for soak applications |
| Layer Clean™ CR | Acid cleaner for spray applications |
| Layer Clean™ NP | Acid cleaner for spray applications |
Step Ten: Electrolytic Plating
Electrolytic Plating
| Product | Description |
|---|---|
| Cubrite CF-110 | Plating additive for electrolytic copper |
| CuBrite™ PC-520 | Plating additive for electrolytic copper |
| TinPlate™ PC-625 | Plaing additive for electrolytic tin |
| CuBrite™ PC-525 | Plating additive for electrolytic copper |
Step Eleven: Outer Layer Resist Strippers
Outer Layer Resist Strippers
| Product | Description |
|---|---|
| ADF-25C | Aqueous Photoresist Stripper Concentrate |
| ADF-72 | Aqueous Resist Stripper |
| LDI Strip 77 | Fine Line Resist Stripper |
| MicroStrip™ 2000 | Fine Line Resist Stripper |
| Microstrip™ONE | Fine Line Resist Stripper |
Step Twelve: Outer Layer Etching
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Step Thirteen: Tin Strippers
Tin Strippers
| Product | Description |
|---|---|
| M-Strip™ | Peroxide-Based Tin/Lead Stripper |
| Magnum™ NPS-220 and Magnum™ NPS-240 | Two Step, Non-Peroxide Solder Stripper |
| Select Strip™ Plus | Whole panel stripper |
| NPS™ 3000 | Single Step Tin Stripper |
| NPS™ 3001 | Single Step Tin Stripper |
| NPS™ 3002 | Enhanced Single Step Tin Stripper |
| NPS™10 & 20 | Non-Peroxide Tin/Lead Stripper |
Step Fourteen: Final Finishes
Final Finishes
| Product | Description |
|---|---|
| Aspect | Organic Solderability Preservative |
| Chemposit Sn | Immersion tin |
Hot Air Leveling (HAL)/Reflow
| Product | Description |
|---|---|
| Acti Flo | HAL flux |
| 291 Flux | HAL flux |
| Board Brite II | Acid cleaner for tin |
| Solder Conditioner 417 | Acid cleaner for tin |
| Thermo Flo™ | Water-soluble fusing fluid |
| Quench Aide™ 96 | Rinse agent |
| Rinse Aide™ 90 | Cleaner |
| Rinse Aide™ 95 | Cleaner |
| LevelCote™ Cover Oil 300 | Solder blanket oil for HAL |
| LevelCote™ Flux 350 | HAL flux |
| Flo Rite™ 60 | HAL flux |
| Flo Rite™ LV | HAL flux |
Other
Commodity Chemicals
| Product | Description |
|---|---|
| Pure Isopropyl Alcohol | colorless, flammable liquid with a characteristic alcohol odor |
| Acidified Pumice | An Acidified Pumice Scrub |
| Copper Sulfate Solution | Uses only sulfuric acid and pure copper metal |
| Hydrochloric Acid 20 Be | Etching Solution |
| Sulfuric Acid 93% PC Grade | PC (Printed Circuit) grade Sulfuric Acid |
Waste Treatment
| Product | Description |
|---|---|
| MetalTreat Chelate Eliminator-8 | Wastewater Treatment Chemical Formulation |
| Metaltreat 529 | Heavy metal precipitant |
| Metaltreat 528 Coagulant | Alternative to DTC Carbamate-type Products |
| Metaltreat 513 | Heavy metal precipitant for wastewater treatment |
| Metaltreat 510 | Ferrous Chloride based heavy metal precipitant |
| Metaltreat 4007 | Wastewater treat coagulant |
| Metaltreat AF 13-10 | Silicone based antifoam for waste treatment application |
| Metaltreat 958 Flocculant | Unique high charge cationic flocculant |
| Metaltreat 957 | Anionic Polymer Wastewater Flocculant |
| Metaltreat 530 | Heavy metal precipitant |
| Resist Treat 5000 | Wastewater coagulant/precipitant |