Graphite Based Direct Metallization for Printed Circuit Boards. Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.
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A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents
De-Ox is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox removes only oxides, and will not attack most metals, except zinc and aluminum.
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.