Graphite Based Direct Metallization for Printed Circuit Boards. Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.