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A mildly activated flux for use prior to hot oil fusing. 291 FLUXis formulated without isopropyl alcohol, making it safer to use and store. It is compatible with THERMO FLO? andPRO FUSEfusing/leveling fluids. 291 FLUXcontains ingredients used in the fusing fluids, which results in reduced consumption and prolongs the life of the fusing fluids.
A non-foaming, acidic cleaner formulated to remove oxide and tarnish from copper surfaces.ACCUCLEAN™NFis sprayable at room temperature and has a very low copper etch rate. It can be used in conveyorized applications for cleaning copper prior to solder mask application, as an activator in automatic tab plating machines, or wherever a sprayable copper cleaner is needed. ACCUCLEAN™NFis supplied in concentrated form.
ACIDIFIED PUMICE is a uniform blend of fine pumice and citric acid, ideally suited for micro-roughening copper surfaces prior to dry film and/or LPI solder mask. The particle distribution of ACIDIFIED PUMICE was selected based upon efficiently processing difficult features, particularly mechanical plugging of high aspect ratio through holes.
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLOis formulated to be compatible with THERMO FLO? and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hard-to-fuse areas and is non-foaming.
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 40also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BATwill generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BATcontains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF-25Cbreaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF-25Cdemonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
Formulated to remove fully aqueous dry films and liquid resists in soak or spray
applications. ADF-55 breaks dry films into particles suitable for filtration and has a low
VOC content for reduced air emissions. ADF-55 contains special copper brightening and
antitarnish agents that produce a bright, uniform copper surface for automatic optical
inspection and better etching characteristics.
A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF-72provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life.
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
An oxidation inhibitor concentrate which is added to water to prevent tarnishing of copper and copper alloys. AT-2000reacts chemically with clean copper surfaces to form an invisible barrier that resists handling and environmental effects. AT-2000can be used prior to resist application, after electroless copper, and in the SMOBC process.
AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and
copper alloys. It reacts chemically with clean copper surfaces to form an invisible barrier
that resists handling and environmental effects. AT-3000 can be used after electroless
copper, prior to photoresist application, and in the SMOBC process. It also can be used as
an additive to photoresist stripping solutions to prevent copper oxidation. When used
following electroless copper deposition, AT-3000 enhances the adhesion of dry film
BOARD BRITE IIis an acid cleaner for cleaning and conditioning tin/lead plated board surfaces. It neutralizes ammonia salt residues from alkaline etchants and removes oxides formed during storage. BOARD BRITE IIcan be used as a pre-cleaner prior to fusing to enhance fusing characteristics. It is effective in both spray and soak applications.
ChemPolish ET (RDX-1096)is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish ET (RDX-1096)leaves a clean finish, free of etching,hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.
ChempositSnplates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit Sndeposits remain solderable for extended periods, (to 6 months) and will not ?Tin Whisker?.Chemposit Sn Immersion Tin plating baths operate more easily and are “poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn may be replenished to maintain key ingredients.
An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
An acidic equipment cleaner designed for use in developers and resist strippers. CITRISUMPis exceptionally effective on solder mask developer residues, carbonate residues, and hard water scale. Its organic acid formula is effective without generating noxious fumes.
RBP?s COPPER SULFATE SOLUTIONis manufactured using only sulfuric acid and pure copper metal. No recycled copper is ever used. This produces a high purity material, which is low in both organic and inorganic impurities. It is intended for the make up and replenishment of acid copper plating solutions, but its high purity also allows it to be used for the make up and replenishment of printed circuit board plating solutions. No purification or filtration is required before use.
A matte acid copper plating additive formulated for plating baths with high throwing power resulting in excellent surface to hole thickness ratios in through-hole plating of printed circuit boards. Based on economical copper sulfate and sulfuric acid, it is easy to make up, operate and control. CuBrite CF-110is a single grain refining agent that is added on an ampere hour basis and is notremoved by circulation of the plating solution through afilter packed with carbon. The addition agent reaction products and organic contamination can thus be removed on a continuous basis to assure excellent deposit ductility. CuBrite CF-110produces fine-grained, soft, matte deposits that insure good solderability, resist adhesion and etch characteristics.
An additive containing the carrier component of the brightener system for CuBrite PC-
525 copper plating bath. CuBrite PC-520 can replenish the carrier component without
excessive additions of brightener to maintain desired characteristics of the plated copper
deposit. It can be used after carbon treatment of the plating bath, or whenever there is
excessive drag-out of the plating solution.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
Developer Defoamer is a fully organic, non-silicone,water soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essentialand it works at any pH. It is odor-free and biodegradable.
A safe solvent based material for the removal of uncured printing inks and solder masks. It contains no chlorinated hydrocarbons and no flammable solvents. DPC-20 SCREEN CLEANER is fast acting and has high holding capacity for economy and higher productivity.
An acidic, solvent-based, soluble equipment cleaner designed for use on photoresist developers and strippers. E-cleanDF is exceptionally effective on dry film resists, antifoam residues, hard water scale and carbonate residues. It effectively cleans the residues inside nozzles and pipes.
Equipment Cleaner IITM removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner IITM may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner IITM is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
EquipmentCleaner IV removes water hardness, photoresist scum and metal salt deposits from chemical processing equipment. Specifically developed for the printed circuit boardindustry it is very useful in spray equipment causing no damage to metal and plastic parts.Equipment Cleaner IV is odorless.
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
Ferric Chloride Solution is acidic and should be handled only with appropriate safety equipment including goggles, gloves and protective clothing. Follow standard laboratory practices. Consult Safety Data Sheet for further information. Used solutions contain metal ions and may require treatment before spent solutions are disposed. Dispose of in accordance with federal, state and local regulations. Contact your RBP representative for further information.Clear to slightly hazy, dark red-brown liquid with a sharp odor.
FinClean CR is a final finish acid cleaner designed for spray application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively strong acidity and reduced surface tension without foaming. Its formulation does not include chloride and chelators, is VOC–free and biodegradable.
FinClean RS is a final finish acid cleaner designed for soak application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively weaker acidity with excellent detergency and thus cleaning performance. Its formulation does not include chloride and is biodegradable.
An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIPcontains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIPproduces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
A chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, where a lower viscosity flux is desired for complete wetting of small holes and surface mount pads. FLO RITE LV provides excellent wetting and even coverage, resulting in a superior solder finish.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
LDI Strip 77 is a semi-aqueous photoresist stripper formulated for stripping very fine line circuit boards. It provides fast and complete resist removal and contains additives that protect metal surfaces against corrosion, including copper and tin. It can be used in both spray and soak applications.
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.
An alkaline liquid designed to remove cured liquid photoimageable solder masks from halogen free laminates. MAGNASTRIP 600 HF works quickly without damage to circuitry on mostlaminates. It breaks down the mask so it rinses easily with little need for brushing or scrubbing to remove fillers.
An alkaline liquid designed to remove fully cured liquid photoimageable acrylic solder masks from printed circuit boards. MAGNASTRIP 500 works quickly without damage to circuitry or laminate. It breaks down the mask so it rinses easily.
Magnum N-499 removes (neutralizes) the residue left on the hole walls following the permanganate desmear/etchback process. It utilizes the “peroxide” chemistry.
Magnum N-499 Peroxide is a stabilized 25% hydrogen peroxide solution. It is designed for use in preparation and replenishment of Magnum N-499.
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
A potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM K-401 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper.
A sodium permanganate based desmear/etchback system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM N-501 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper. Using MAGNUM N-501 OXIDIZER, positive etchback can be obtained with three-point connection of the inner layer in most resin systems.
A neutralizer for oxidizer residue left on the hole wall following the permanganate desmear/etchback process. MAGNUM N-599 is used following treatment with MAGNUM K-OXIDIXER or MAGNUM N-OXIDIZER. MAGNUM GE-600 glass etch can be added to the solution to etch back the protruding glass bundles.
The first part of a three step process for multilayer hole preparation. MAGNUM S-400 is used to prepare resinous substrates for subsequent oxidation by permanganate. When used in conjunction with MAGNUM K-OXIDIZER or MAGNUM N-OXIDIZER, it penetrates resin smear for effective desmear and etchback. It is equally effective on epoxy and polyimide resin systems. The solution is replenishable and the boards need not be dried prior to processing.
MAGNUM S-450 is used to condition holes after drilling and before the desmear step in preparation for metallization. It is effective on a variety of resin materials including epoxy and polyimide. It is replenishable and does not require circuit boards to be dried prior to processing. Use in conjunction with MAGNUM K-OXIDIZER or MAGNUM N-OXIDIZER for desmear and etchback.
MaskStrip is designed to remove uncured UV and thermal solder mask from printed circuit boards and screens. MaskStrip is fully water rinseable and does not affect laminate or metal plating. With proper dilution, rinse waters may not require special treatment. Screening frames and fabrics will not be harmed with this process.
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
MicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide layers from the copper surface prior to photoresist lamination.
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.
A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM ETCH provides a superior microetch which can be used for inner layer processing, pre-plate cleaning, and cleaning prior to solder leveling. For pre-plate cleaning of panels plated with electroless copper, use the low etch rate operating conditions. QUANTUM ETCH produces a uniformly etched surface, and will maintain a constant desired etch rate over a broad solubility range of copper sulfate in the bath.
For use following hot air leveling or fusing. QUENCH AIDE 96 reduces the temperature of the panels at a steady rate, preventing thermal shock and maintaining a bright, even solder appearance. It is non-foaming and rinses easily with water.
RESIST TREAT 5000is a calcium chloride based coagulant/precipitant designed to promote dissolution and separation of dissolved organic photopolymer from monoethanolamine based photopolymer strippers. When used as part of a treatment process, the resulting supernatant liquidis, in most regions, suitable for direct sewering.
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.
A completely biodegradable concentrate formulated for removing flux residues from printed circuit boards. It effectively removes both ionic and non-ionic surfactants left on fused boards. It also removes processing residues on SMOBC boards when used prior to solder mask application. RINSE AIDE 90 is effective in soak and spray applications.
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
Screen Wash LO is a custom formulated blend of aromatic and oxygenated solvents with high solvency and fast evaporation rate.
SCREENSOL ER-250 is designed to remove emulsion and residue from printed circuit board imaging screens. SCREENSOL ER-250 is ready to use. This state-of-the-art product is fast acting, odorless, and non-corrosive. It replaced outdated bleaches and other toxic solvents.
An economical, solvent based screen wash formulated to remove solvent processible inks from printed circuits screens and boards without leaving residue.
An economical, non-flammable screen wash formulated to remove solvent processible inks from printed circuits screens and boards without leaving residue.
A highly concentrated product formulated to remove today’s newest dry film resists in
soak or spray applications, at 5% concentration. SEMICON RESIST STRIP breaks dry
films into particles suitable for filtration. It also protects panels from staining caused by
dyes in the photoresists. SEMICON RESIST STRIP demonstrates consistently high
An acid tin/lead cleaner designed to remove salt residues that remain after alkaline etching. The removal of these salts is essential to ensuring good fusing and a bright finished solder surface. SOLDER CONDITIONER 417is effective at eliminating re-deposition of tin on copper surfaces and allows re-etching of panels, thus minimizing rejects. Effective for both soak and spray applications. SOLDER CONDITIONER 417is an excellent pre-cleaner priorto fusing for eliminating oxides and enhancing solder edge coverage on circuits.
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
A pleasant smelling, hexane free film cleaner that removes grease and other soil marks from all types of film, including silver and diazo emulsion imaging films. SPECIAL FILM CLEANER contains a powerful antistatic agent to remove static from non-conductive film and effectively removes tape adhesive marks. Water soluble opaque inks are not affected by SPECIAL FILM CLEANER.
A liquid concentrate designed to clean and condition resist developing and Resist Stripper machines. It has an increased capability to remove stubborn dye and antifoam residues, and other insoluble materials, along with residues from dry film photoresists and solder masks. A regular maintenance program using SUMP DOCTOR will insure maximum efficiency from equipment, consistent high quality product and minimal downtime.
A non-chelating, acidic equipment cleaner designed for use in developers and resist strippers.
SUMP PRO is exceptionally effective on resist and antifoam residues, hard water scale, and
carbonate residues. It contains a penetrating ingredient to enhance its ability to remove
caked-on residues. Its organic acid formula is effective without generating noxious fumes,
and is non-chelating for easier waste treatment.
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
A synthetic, water soluble fusing fluid that has been custom blended for tin/lead fusing and leveling. Additives for greater thermal stability increase the bath life and reduce smoking. THERMO FLO™maintains a high level of performance, providing an excellent surface finish with complete edge coverage throughout its bath life.
A liquid concentrate designed to clean and condition developing and resist stripping machines, and other equipment. TIDY SUMP will remove a variety of contaminants such as residues from dry film photoresists, soldermasks, and antifoams. A regular maintenance program using TIDY SUMPwill insure maximum efficiency from equipment, consistent high quality product and minimum down-time.
TinPlate PC-625 is an organic grain refiner that is used to aid in the electroplating of tin in
the application for SMOBC fabrication. TinPlate PC-625 is formulated to improve the
throwing power of the bath, aid in refining grain structure, and prevent treeing. It is added
based on amp hours and will increase limiting current density and control deposit
characteristics over a wide range of current densities. It produces a bright silver white
deposit. TinPlate PC-625 eliminates the need for lead and fluoborates used in
conventional etch resist plating processes. If an extra wetting agent is needed,
use TinPlate PC-625 Starter. Please consult your service representative for additions.
Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the copper. ULTRACLEAN NF is especially recommended for cleaning Invar/copper laminate and double treated copper foil. Also for use prior to resist lamination, oxide treatment and plating processes. Its non-chelating formula allows for easy waste treatment. ULTRACLEAN NF is non-foaming for use in conveyorized spray applications.
A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresists. It can be used on both inner and outer layers and produces large particles suitable for filtration. ULTRASTRIP contains copper brightening agents to provide a bright, uniform surface. It contains NO glycol ether solvents for a safer working environment.ULTRASTRIP BAT contains antitarnish agents which preserve the copper surface for automatic optical inspection and better etching characteristics.