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291 Flux
A mildly activated flux for use prior to hot oil fusing. 291 FLUXis formulated without isopropyl alcohol, making it safer to use and store. It is compatible with THERMO FLO? andPRO FUSEfusing/leveling fluids. 291 FLUXcontains ingredients used in the fusing fluids, which results in reduced consumption and prolongs the life of the fusing fluids.
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Accuclean NF
A non-foaming, acidic cleaner formulated to remove oxide and tarnish from copper surfaces.ACCUCLEAN™NFis sprayable at room temperature and has a very low copper etch rate. It can be used in conveyorized applications for cleaning copper prior to solder mask application, as an activator in automatic tab plating machines, or wherever a sprayable copper cleaner is needed. ACCUCLEAN™NFis supplied in concentrated form.
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Acidified Pumice
ACIDIFIED PUMICE is a uniform blend of fine pumice and citric acid, ideally suited for micro-roughening copper surfaces prior to dry film and/or LPI solder mask. The particle distribution of ACIDIFIED PUMICE was selected based upon efficiently processing difficult features, particularly mechanical plugging of high aspect ratio through holes.
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Acti Flo
A mildly activated, water soluble flux for use prior to hot oil pot fusing. ACTI-FLOis formulated to be compatible with THERMO FLO? and PRO FUSE. It contains ingredients used in the fusing fluids, which results in reduced consumption and extended fluid life as the flux is dragged in. It provides consistent surface smoothness, even for hard-to-fuse areas and is non-foaming.
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ADC-40
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresist. It is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. ADC 40also works well for developing aqueous photoimageable solder masks, or other applications where carbonate is used.
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ADF-10 BAT
Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BATwill generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BATcontains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.
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ADF-25
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
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ADF-25C
A highly concentrated product formulated to remove today’s newest dry film resists in soak or spray applications, at 5% concentration. ADF-25Cbreaks dry films into particles suitable for filtration. It also protects panels from staining caused by dyes in the photoresists. ADF-25Cdemonstrates consistently high loading capabilities and contains an enhanced copper brightening and antitarnish package. This enables it to produce bright, uniform copper surface for automatic optical inspection and better etching capabilities.
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ADF-30
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
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ADF-35
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
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ADF-55
Formulated to remove fully aqueous dry films and liquid resists in soak or spray
applications. ADF-55 breaks dry films into particles suitable for filtration and has a low
VOC content for reduced air emissions. ADF-55 contains special copper brightening and
antitarnish agents that produce a bright, uniform copper surface for automatic optical
inspection and better etching characteristics. -
ADF-72
A photoresist stripper formulated to remove a wide variety of fully aqueous photo resists in a spray application. ADF-72provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life.
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Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
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Aspect
Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface count technology. It can be used for mixed final finish, ENIG/OSP applications. Aspect is supplied in three concentrated components, two for bath make-up and an additional component for non-regular replenishment. It contains a substituted imidazole, acetic acid and is Cu-free. Treated Cu surfaces are covered with a thin (0.2 – 0.4 micron), nearly colorless and transparent coating.
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AT-2000
An oxidation inhibitor concentrate which is added to water to prevent tarnishing of copper and copper alloys. AT-2000reacts chemically with clean copper surfaces to form an invisible barrier that resists handling and environmental effects. AT-2000can be used prior to resist application, after electroless copper, and in the SMOBC process.
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AT-3000
AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and
copper alloys. It reacts chemically with clean copper surfaces to form an invisible barrier
that resists handling and environmental effects. AT-3000 can be used after electroless
copper, prior to photoresist application, and in the SMOBC process. It also can be used as
an additive to photoresist stripping solutions to prevent copper oxidation. When used
following electroless copper deposition, AT-3000 enhances the adhesion of dry film
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Board Brite II
BOARD BRITE IIis an acid cleaner for cleaning and conditioning tin/lead plated board surfaces. It neutralizes ammonia salt residues from alkaline etchants and removes oxides formed during storage. BOARD BRITE IIcan be used as a pre-cleaner prior to fusing to enhance fusing characteristics. It is effective in both spray and soak applications.
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ChemPolish™ ET
ChemPolish ET (RDX-1096)is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish ET (RDX-1096)leaves a clean finish, free of etching,hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.
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Chemposit Sn
ChempositSnplates a dense, smooth Tin deposit onto copper alloys leaving a corrosion resistant surface that is highly solderable, even when the substrate was not. Chemposit Sndeposits remain solderable for extended periods, (to 6 months) and will not ?Tin Whisker?.Chemposit Sn Immersion Tin plating baths operate more easily and are “poisoned” less readily than other Immersion Tin plating chemistries. Chemposit Sn may be replenished to maintain key ingredients.
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Circutek A-778
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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Circutek C-877
Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
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Circutek CC-710
An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC-710is supplied as a liquid concentrate.
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Circutek CC-720
Circutek CC-720 is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces such as organic resin and glass for subsequent catalyst chemisorption and electroless copper deposition.
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Circutek EC-807
Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
