Circutek PC-701
A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
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