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Circutek A-778
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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Circutek C-877
Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
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Circutek CC-710
An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC-710is supplied as a liquid concentrate.
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Circutek CC-720
Circutek CC-720 is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces such as organic resin and glass for subsequent catalyst chemisorption and electroless copper deposition.
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Circutek EC-807
Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
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Circutek PC-701
A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-701 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuit boards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
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Circutek PC-801
A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuitboards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
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Circutek PD-776
Pre-dip solution used in conjunction with CIRCUTEK C-777activator in catalyzing the substrate for subsequent electroless copper deposition. CIRCUTEK PD-776replaces the hydrochloric acid and water normally used in the step prior to the activator and in the activator solution itself.
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Circutek™ ME-515
A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards.
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Onyx
Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.
