A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards. CIRCUTEK ME-515 operating solution is specially formulated to be used in place of a sulfuric/peroxide or sodium or ammonium persulfate etching solution. It is excellent for removing tarnish and oxidation from the copper surface, and can be used prior to electroless and electrolytic plating, after tab stripping.
When used prior to electrolytic plating as part of a pattern cleaning system, CIRCUTEK ME-515 cleans and etches copper surfaces. It aids in the removal of dry film binder residues that penetrate into the copper-clad surface of printed circuit boards.
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
De-Ox is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox removes only oxides, and will not attack most metals, except zinc and aluminum.
Provides an effective clean out of Cupric Etcher sumps along with manual removal of deposits on the etch chamber walls. CUPRIC ETCH EQUIPMENT CLEANER will dissolve Dry Film deposits built up between PM’s. CUPRIC ETCH EQUIPMENT CLEANER has a low VOC content for reduced air emissions.