A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards. CIRCUTEK ME-515 operating solution is specially formulated to be used in place of a sulfuric/peroxide or sodium or ammonium persulfate etching solution. It is excellent for removing tarnish and oxidation from the copper surface, and can be used prior to electroless and electrolytic plating, after tab stripping.
When used prior to electrolytic plating as part of a pattern cleaning system, CIRCUTEK ME-515 cleans and etches copper surfaces. It aids in the removal of dry film binder residues that penetrate into the copper-clad surface of printed circuit boards.
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An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
VersaClean is formulated to clean multiple metallic surfaces including aluminum, copper, Sn/Pb solder (HASL), Pb-free solder, and ENIG. It is characterized by very good detergency while exhibiting no corrosion of these surfaces.