Copper Cleaning

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    Accuclean NF

    A non-foaming, acidic cleaner formulated to remove oxide and tarnish from copper surfaces.ACCUCLEAN™NFis sprayable at room temperature and has a very low copper etch rate. It can be used in conveyorized applications for cleaning copper prior to solder mask application, as an activator in automatic tab plating machines, or wherever a sprayable copper cleaner is needed. ACCUCLEAN™NFis supplied in concentrated form.

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    Circutek™ ME-515

    A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards.

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    FinClean CR

    FinClean CR is a final finish acid cleaner designed for spray application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively strong acidity and reduced surface tension without foaming. Its formulation does not include chloride and chelators, is VOC–free and biodegradable.

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    FinClean RS

    FinClean RS is a final finish acid cleaner designed for soak application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively weaker acidity with excellent detergency and thus cleaning performance. Its formulation does not include chloride and is biodegradable.

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    Layer Clean™ CR

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    Layer Clean™ NP

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    Posiclean™ MR

    An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.

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    Posiclean™ M

    An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.

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    PrepBond™

    An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.

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    Ultraclean™ NF

    Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the copper. ULTRACLEAN NF is especially recommended for cleaning Invar/copper laminate and double treated copper foil. Also for use prior to resist lamination, oxide treatment and plating processes. Its non-chelating formula allows for easy waste treatment. ULTRACLEAN NF is non-foaming for use in conveyorized spray applications.

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    VersaClean

    VersaClean is formulated to clean multiple metallic surfaces including aluminum, copper, Sn/Pb solder (HASL), Pb-free solder, and ENIG. It is characterized by very good detergency while exhibiting no corrosion of these surfaces.