Copper Cleaning

 
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    Accuclean NF

    A non-foaming, acidic cleaner formulated to remove oxide and tarnish from copper surfaces.ACCUCLEAN™NFis sprayable at room temperature and has a very low copper etch rate. It can be used in conveyorized applications for cleaning copper prior to solder mask application, as an activator in automatic tab plating machines, or wherever a sprayable copper cleaner is needed. ACCUCLEAN™NFis supplied in concentrated form.

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    ASPECT™

    Organic Solderability Preservative Final Finish for Printed Circuit Boards. Aspect is an organic solderability preservative developed for high temperature processing in Pb-free assembly. It is compatible with through-hole and surface mount technology. It can be used for mixed final finish, ENIG/OSP applications.

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    AT-3000

    AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and
    copper alloys. It reacts chemically with clean copper surfaces to form an invisible barrier
    that resists handling and environmental effects. AT-3000 can be used after electroless
    copper, prior to photoresist application, and in the SMOBC process. It also can be used as
    an additive to photoresist stripping solutions to prevent copper oxidation. When used
    following electroless copper deposition, AT-3000 enhances the adhesion of dry film
    photoresists.

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    ChemPrep™

    ChemPrepTMis a mildly acidic cleaner used as the final step in preparing copper for subsequent processes requiring an extreme level of cleanliness. ChemPrepTM removes anti-tarnish coatings found as protective covering on incoming foils and laminate which prevents halos and streaking. Used in combination with MicroClean_ CuLX, mechanical scrubbing can be eliminated prior to photoresist, electroless Cu, or oxide application. The elimination of scrubbing allows more uniform line definition without directional gouges. The resultant surface is uniformly activated and free of waterbreak, while contamination becomes soluble and is easily rinsed. At higher temperatures ChemPrepTM will easily remove organic soils, fingerprints and some polymeric residuals from inks, dry films, and solder masks. It is an ideal preparation for solder leveling and roller tinning. Under normal conditions, the etch rate is less than 1 microinch/minute.

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    CircuitPrep™

    CircuitPrep™is an acid cleaner designed to thoroughly clean copper before plating. CircuitPrep™ will not lift or soften dry film or screen resists. CircuitPrep™ may be used as a precleaner before microetch. CircuitPrep™ may also be used to remove oxides from copper before copper or tin plating, as it contains nothing that will interfere with plating solutions.

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    Circutek AC300

    An acid solution formulated specifically to remove the chromate coating from copper-clad laminate prior to innerlayer cleaning and imaging, on oxide lines or in applications where the chromate coating must be removed prior to microetching.

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    FlexClean DM™

    FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.

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    Formance K™

    Immersion Silver Final Finish for Printed Circuit Boards. Formance K has been developed to deposit pure, solderable silver layer on copper circuitry in compliance with IPC specification no. IPC-4553A. The deposit satisfies Class 3 final finish durability and is an excellent choice for demanding Pb-free assembly. Formance K is an easy to use product with simple analytical controls and straightforward replenishment that leads to lower running cost. Notably, the chemistry is EDTA- and alkylphenol ethoxylate-free and thus biodegradable.

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    HASL Precleaner SL™

    HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Precleaner SLTM will not etch copper nor will it damage the. HASL Precleaner SLTM can be used in conjunction with a light microetch or acid cleaner. If an acid cleaner is used, MicroCleanTM ZE is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate. Because of the potent cleaning agents that destroy organo-metallic compounds (such as insoluble copper/soldermask compounds) present on the copper surfaces, use of HASL Precleaner SLTM will reduce the requirement for a second pass through the HASL.

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    LAYER CLEAN™ CR

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    LAYER CLEAN™ NP

    An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.

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    MAGNABOND™ CO-300

    A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.

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    MAGNABOND™ OxAlt

    MAGNABOND OxAlt is a three-part micro-etch additive designed to promote mechanical copper-epoxy bonding by optimizing the topography of the copper substrate. MAGNABOND OxAlt offers several benefits over other conventional oxide and competitive oxide alternatives, including: low cost of operation; ease of control, and consistent copper topography at etch rates of 40 microinches per minute. A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the MAGNABOND OxAlt.

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    ME 515L

    A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.

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    MicroClean™ NE

    MicroClean NEis a low-foaming cleaner for removing fingerprints as well as chromate and oxide layers from the copper surface prior to photoresist lamination.MicroClean NE contains no solvents and is biodegradable.

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    MicroClean™ CuL

    MicroClean CuL is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

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    MicroClean™ CuLX

    MicroClean CuLX is a micro-cleaner” that is designed to remove extremely tenacious soils from copper

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    MICROCLEAN™ TA

    MicroClean TA is a low-foaming cleaner for removing fingerprints as well as chromate and oxide layers from the copper surface prior to photoresist lamination. MicroClean TA contains no solvents.

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    MicroClean™ ZE

    MicroClean ZE is a low-foaming cleaner for removing fingerprints as well as chromate and oxide layers from the copper surface prior to photoresist lamination.

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    NC ACID CLEANER™

    An acid, organic, non-etching cleaner that has been specifically formulated to remove organic and inorganic contaminants. NC ACID CLEANER removes soils such as fingerprints, oxides and chromate conversion coating prior to photoresist lamination, oxide treatment, and multilayer lamination to improve adhesion. It is compatible with photoresists making it effective for pattern plate cleaning. Its non-chelating formula cleans and conditions copper surfaces and can be followed by a microetch for optimum performance. It is effective in both spray and soak applications.

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    Onyx

    Onyx is a process in which a proprietary graphite dispersion is used to impart electrical conductivity on through holes and vias of printed circuit boards. This process prepares the board for copper electroplating in a similar way electroless copper process does but with the benefits of simplicity and environmental friendliness. Onyx consists of a short sequence of chemical steps that include conditioning with Onyx CC, graphite application with Onyx DM and leveling with Onyx LV.

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    Posiclean™ MR

    An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.

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    POSICLEAN™ M

    An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.

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    PreLam™ Cleaner

    PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.

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    PreLam™ Cleaner S

    PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.

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