Posiclean™ MR
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.
Download Data Sheets
Related products
-
VersaClean
VersaClean is formulated to clean multiple metallic surfaces including aluminum, copper, Sn/Pb solder (HASL), Pb-free solder, and ENIG. It is characterized by very good detergency while exhibiting no corrosion of these surfaces.
-
DX™45 Plus
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
-
Dual Strip™ BAT
Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
