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Formulated to provide the ultimate in speed for automated tab plating machines while
maintaining excellent capacity. M-STRIP will remove 0.5 mil of unfused tin/lead within 20
seconds in spray application.
An alkaline liquid designed to remove fully cured liquid photoimageable acrylic solder masks from printed circuit boards. MAGNASTRIP 500 works quickly without damage to circuitry or laminate. It breaks down the mask so it rinses easily.
An economical two-step solder stripper that rapidly strips tin/lead or tin deposits from
printed circuit boards. MAGNUM NPS-220 removes all but a thin protective layer of
metallic tin to inhibit excessive attack on the underlying copper. The protective layer of tin
is then removed with MAGNUM NPS-240.
MAGNUM NPS-240 quickly removes the intermetallic layer, leaving a clean, tarnish-free
copper surface. It can be used following standard tin strippers, and also to clean copper
prior to hot air leveling. It contains no fluorides, peroxide or ammonium compounds.
A nitric acid based solution for stripping tin or tin/lead from printed circuit boards. NPS 3000 strips quickly and effectively, maintains a high loading capacity and leaves a clean copper surface for subsequent processes. For use in spray or soak applications.
A nitric acid based solution for stripping tin or tin/lead from printed circuit boards. NPS 3001 strips quickly and effectively, maintains a high loading capacity and leaves a clean copper surface for subsequent processes. For use in spray or soak applications.
A concentrated nitric acid based tin stripper with exceptional loading capacity, high strip speed, and resistance to exotherming. NPS 3002 is designed for use in high speed, steadystate, high volume applications. It leaves a bright copper surface for subsequent processes. NPS 3002 has a high tin holding capacity, greatly reducing re-deposition of tin oxide on equipment surfaces and in spray nozzles.
A two step, high capacity alternative to peroxide tin/lead stripping. It is especially formulated for intermittent use in whole panel stripping. It can be used in either spray or soak applications without the worry of laminate attack or “run-away” peroxide reactions. NPS 10 is designed to remove the bulk of the tin/lead deposit safely, while leaving behind a thin intermetallic layer that protects the copper from chemical attack. NPS 20 removes the remaining intermetallic layer left after stripping in NPS 10. It works very quickly, with minimal copper attack, and will last 2-3 times as long as NPS 10.