• Acidified Pumice

    ACIDIFIED PUMICE is a uniform blend of fine pumice and citric acid, ideally suited for micro-roughening copper surfaces prior to dry film and/or LPI solder mask. The particle distribution of ACIDIFIED PUMICE was selected based upon efficiently processing difficult features, particularly mechanical plugging of high aspect ratio through holes.

  • Copper Sulfate Solution

    RBP?s COPPER SULFATE SOLUTIONis manufactured using only sulfuric acid and pure copper metal. No recycled copper is ever used. This produces a high purity material, which is low in both organic and inorganic impurities. It is intended for the make up and replenishment of acid copper plating solutions, but its high purity also allows it to be used for the make up and replenishment of printed circuit board plating solutions. No purification or filtration is required before use.

  • Hydrochloric Acid 20 Be

    Hydrochloric Acid 20Be is used in Step Four: Inner Layer Etching. This product should be used only for its intended purpose.

  • Pure Isopropyl Alcohol

    Isopropyl Alcohol is a colorless, flammable liquid with a characteristic alcohol odor. It is completely miscible with most solvents, including water, and is a suitable solvent for acrylic and epoxy resins, ethyl cellulose, natural resins, gums, polyvinyl butyral, alkaloids, and some essential oils.

  • Sulfuric Acid 93% PC Grade

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