Sulfuric Acid 93% PC Grade
Download Data Sheets
Related products
-
De-Ox™ II
De-Ox II is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox II deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox II removes only oxides, and will not attack most metals, except zinc and aluminum. De-Ox II does not attack plastic surfaces in test sockets.
-
De-Ox™
De-Ox is a de-oxidizer that will remove tin, lead oxides as well as other oxides from contact surfaces minimizing resistance levels and restoring semiconductor test sockets to optimal performance. De-Ox deoxidizes without “activating” the metal surface therefore subsequent re-growth of oxides is not altered. De-Ox removes only oxides, and will not attack most metals, except zinc and aluminum.
-
DX™45 Plus
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”
