Hydrochloric Acid 20 Be
HydrochloricAcid 20Be is used in Step Four: Inner Layer Etching. This product should be used only for its intended purpose.
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Download Data Sheets
HydrochloricAcid 20Be is used in Step Four: Inner Layer Etching. This product should be used only for its intended purpose.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
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