Products
Acidified Pumice
ACIDIFIED PUMICEis a uniform blend of fine pumice and citric acid, ideally suited for micro-roughening copper surfaces prior to dry film and/or LPI solder mask. The particle distribution of ACIDIFIED PUMICEwas selected based upon efficiently processing difficult features, particularly mechanical plugging of high aspect ratio through holes.
Download Data Sheets :
Related products
-
Layer Clean™ CR
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
-
Cupric Etching Equipment Cleaner
Provides an effective clean out of Cupric Etcher sumps along with manual removal of deposits on the etch chamber walls. CUPRIC ETCH EQUIPMENT CLEANER will dissolve Dry Film deposits built up between PM’s. CUPRIC ETCH EQUIPMENT CLEANER has a low VOC content for reduced air emissions.
-
FoamFREE™ 940
A highly effective foam suppressant for aqueous developing and stripping of DuPont™ RISTON® photopolymer films. FoamFREE 940 is a stable product which efficiently disperses foam in low concentrations.
