FinClean CR
FinClean CR is a final finish acid cleaner designed for spray application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively strong acidity and reduced surface tension without foaming. Its formulation does not include chloride and chelators, is VOC–free and biodegradable.
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Equipment Cleaner II™
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
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Layer Clean™ CR
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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FinClean RS
FinClean RS is a final finish acid cleaner designed for soak application and developed for use with immersion silver, OSP and other finishes. It is characterized by a relatively weaker acidity with excellent detergency and thus cleaning performance. Its formulation does not include chloride and is biodegradable.
