VersaClean is formulated to clean multiple metallic surfaces including aluminum, copper, Sn/Pb solder (HASL), Pb-free solder, and ENIG. It is characterized by very good detergency while exhibiting no corrosion of these surfaces.
Provides an effective clean out of Cupric Etcher sumps along with manual removal of deposits on the etch chamber walls. CUPRIC ETCH EQUIPMENT CLEANER will dissolve Dry Film deposits built up between PM’s. CUPRIC ETCH EQUIPMENT CLEANER has a low VOC content for reduced air emissions.
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore
A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards.