PrepBond™
An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete surface preparation for this process, eliminating the need for a microetch. It completely removes residues from Resist Stripper, and is extremely effective for removing handling soils and fingerprints. For spray, flood and soak applications.
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Defoamer FE™
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
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DX™45 NH
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 NH contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These same ingredients help keep the equipment clean
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Layer Clean™ NP
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
