Posiclean™ M
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN M is formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior to oxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN M can be followed by a microetch when necessary for increased adhesion.
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DX™ Strip BAT
Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.
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Posiclean™ MR
An acid soak cleaner that removes oxidation, tarnish and organic soils from copper surfaces. POSICLEAN™MRis formulated to clean effectively in a variety of applications such as pre-clean prior to copper pattern plate, prior to dry film lamination, prior tooxide process, and as a pre-clean for tin or tin/lead electroplating. POSICLEAN™MRcan be followed by a microetch when necessary for increased adhesion.POSICLEAN™MRis a close relative ofPOSICLEAN™M.
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Circutek™ ME-515
A powdered material that is mixed with water and sulfuric acid to make a mild etch solution for copper and copper alloys. The operating solution provides a bright, clean, uniformly etched copper surface on printed circuit boards. CIRCUTEK ME-515 operating solution is specially formulated to be used in place of a sulfuric/peroxide or sodium or ammonium persulfate etching solution. It is excellent for removing tarnish and oxidation from the copper surface, and can be used prior to electroless and electrolytic plating, after tab stripping.
When used prior to electrolytic plating as part of a pattern cleaning system, CIRCUTEK ME-515 cleans and etches copper surfaces. It aids in the removal of dry film binder residues that penetrate into the copper-clad surface of printed circuit boards.
