Circutek PD-776
Pre-dip solution used in conjunction with CIRCUTEK C-777activator in catalyzing the substrate for subsequent electroless copper deposition. CIRCUTEK PD-776replaces the hydrochloric acid and water normally used in the step prior to the activator and in the activator solution itself.
Download Data Sheets
Related products
-
FoamFREE™ One
A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents
-
DX™45 HW
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore
-
DX™ Strip BAT
Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.
