Circutek A-778
An acidic liquid concentrate which modifies palladium catalyzed surfaces for subsequent deposition of electroless copper. CIRCUTEK A-778produces a highly active surface for initiating rapid copper deposition while protecting the electroless copper bath from drag in contamination from the activator solution.
Download Data Sheets
Related products
-
MagnaBond™ CO-300
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
-
FoamFREE™ One
A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents
