An alkaline solution to prepare and condition printed circuit boards for through-hole metallization. CIRCUTEK CC-710is specially formulated to remove fingerprints, light soil and other contaminates from copper foil. It also conditions hard to catalyze surfaces such as organic resin and glass for subsequent electroless copper deposition. CIRCUTEK CC-710is supplied as a liquid concentrate.
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A chloride-organic acid activated flux designed for maximum performance in vertical hot air leveling machines, where a lower viscosity flux is desired for complete wetting of small holes and surface mount pads. FLO RITE LV provides excellent wetting and even coverage, resulting in a superior solder finish.
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
A one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 PLUS’ highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate formulated to develop fully aqueous dry film photoresists and photoimageable”