A high speed, electroless copper process which is capable of depositing 80 -100 millionths of copper in 30 minutes. CIRCUTEK PC-801 deposits a dense, adherent copper film on catalyzed surfaces for the production of printed circuitboards.The solution is easy to control and has a broad operating temperature range. The copper produced is a bright pink, fine-grained deposit, which is readily receptive to subsequent copper electrodeposition.
Download Data Sheets
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
LEVELCOTE COVER OIL 300 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. It prevents the formation of dross by eliminating contact of oxygen to molten solder. When used un a recirculation or oil injection system, LEVELCOTE COVER OIL 300 will lubricate pumps and internal transport mechanisms of horizontal hot air leveling equipment, reducing solder webbing.