Rinse Aide™ 95
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
Download Data Sheets
Download Data Sheets
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
Formulated to remove fully aqueous dry films and screen ink resists in soak or spray applications. DUAL STRIP will generally break dry films into particles suitable for filtration. DUAL STRIP has a low VOC content for reduced air emissions. DUAL STRIP BAT contains additional copper brightening and antitarnish agents that produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
Provides additional antitarnish protection while removing fully aqueous liquid photoresists in spray or soak applications. DX STRIP BAT is also effective on aqueous dry film photoresists, and on a combination of liquid and dry film resists being stripped in the same process. It will generally break dry films into particles suitable for filtration. DX STRIP BAT has a low VOC content for reduced air emissions.
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