Products
Magnum™ K-401 Oxidizer
A potassium permanganate-based desmear system designed to efficiently remove sensitized resinous material from the hole wall of printed circuit boards. MAGNUM K-401 OXIDIZER produces a microporous surface topography to improve catalyst absorption and hole wall adhesion of electroless copper.
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FoamFREE™ 940
A highly effective foam suppressant for aqueous developing and stripping of DuPont™ RISTON® photopolymer films. FoamFREE 940 is a stable product which efficiently disperses foam in low concentrations.
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DX™45 HW
A liquid 45% potassium carbonate concentrate formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45 HW contains a unique blend of ingredients to ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. Furthermore
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Flo Rite™ 60
FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
