ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIPcontains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIPproduces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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