Uncategorized Chemical Products - RBP Chemical Technology

ADF-10 BAT

Specially formulated to remove semi-and fully aqueous dry film and screen ink resists. ADF-10 BATwill generally break dry films into very minute particles. It contains copper brightening agents for uniform, clean copper appearance. ADF-10 BATcontains additional copper brightening and antitarnish agents to preserve a bright copper surface for increased etching capability and to protect the copper surface if boards are held in a corrosive environment.
ADF-25

Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
ADF-30

A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
ADF-35

Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
Aqua Flo

An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
Circutek C-777

Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
Circutek C-877

Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
Circutek EC-807

Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.
D-4000™ Liquid Developer

A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous Riston® photopolymer films. D-4000 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It is formulated to give optimum results with DuPont™ Riston® films and FoamFREE™ defoamers in conveyorized spray developer equipment.
Developer Defoamer™

Developer Defoamer is a fully organic, non-silicone,water soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essentialand it works at any pH. It is odor-free and biodegradable.
DX™40

A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle
DX™45

A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45’s highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photore”
FlexClean DM™

FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
Flexstrip

An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIPcontains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIPproduces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
HASL Precleaner SL™

HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Precleaner SLTM will not etch copper nor will it damage the. HASL Precleaner SLTM can be used in conjunction with a light microetch or acid cleaner. If an acid cleaner is used, MicroCleanTM ZE is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate. Because of the potent cleaning agents that destroy organo-metallic compounds (such as insoluble copper/soldermask compounds) present on the copper surfaces, use of HASL Precleaner SLTM will reduce the requirement for a second pass through the HASL.
In-Process Defoamer™
ME 515L

A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
PreLam™ Cleaner

PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
PreLam™ Cleaner S

PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
ResiStrip™ PC

ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
ResiStrip™ 5000

ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.
ResiStrip™ CM

ResiStrip CM is designed to satisfy the chemical milling industry’s requirements for a fast and cost effective stripper for copper, Alloy 42 and stainless steel. It will leave copper in a bright tarnish-free condition and will remove any staining of stainless steel from the photoresist. It also gives a small stripped particle size.
ResiStrip™ PFBZ (RDZ-1657)

ResiStrip PFBZ is formulated to remove a wide variety of fully aqueous photoresists in a spray application. It provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles for extended bath life.
ResiStrip™ SR

ResiStrip™ SR is designed to the chemical milling industry’s requirements for stripping resist from Copper, Alloy 42 and Stainless Steel. ResiStrip™ SR strips thoroughly and quickly while leaving the base metal in a bright tarnish free condition.
ResiStrip™ VI

ResiStrip VI is designed to address the chemical milling industry’s requirements for a fast and cost effective stripper for Copper, Alloy 42, and stainless steel. ResiStrip VI strips thoroughly and quickly, while costing a fraction of conventional proprietary stripping systems. ResiStrip VI leaves copper in a bright, tarnish free condition and will remove any staining of stainless steel from the photoresist. ResiStrip VI gives a small stripped particle size.