ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
Download Data Sheets
Download Data Sheets
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
Developer Defoamer is a fully organic, non-silicone,water soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essentialand it works at any pH. It is odor-free and biodegradable.
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45’s highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photore”
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