ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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HASL Precleaner SL™
HASL Precleaner SLTM is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Precleaner SLTM will not etch copper nor will it damage the. HASL Precleaner SLTM can be used in conjunction with a light microetch or acid cleaner. If an acid cleaner is used, MicroCleanTM ZE is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate. Because of the potent cleaning agents that destroy organo-metallic compounds (such as insoluble copper/soldermask compounds) present on the copper surfaces, use of HASL Precleaner SLTM will reduce the requirement for a second pass through the HASL.
