ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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PreLam™ Cleaner S
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
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ADF-25
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
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ME 515L
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
