Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
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ResiStrip™ 5000
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Solder Conditioner II™
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
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Flexstrip
An aqueous photoresist stripper specifically formulated for flexible circuit stripping operations. FLEXSTRIPcontains copper antitarnish agents providing a cleaner surface for subsequent flex material processing. FLEXSTRIPproduces fast strip speeds while producing large particles suitable for filtration. It contains no glycol ether solvents for greater compatibility with flex materials and a safer working environment.
