Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
Download Data Sheets
Related products
-
PreLam™ Cleaner
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
-
ResiStrip™ VI
ResiStrip VI is designed to address the chemical milling industry’s requirements for a fast and cost effective stripper for Copper, Alloy 42, and stainless steel. ResiStrip VI strips thoroughly and quickly, while costing a fraction of conventional proprietary stripping systems. ResiStrip VI leaves copper in a bright, tarnish free condition and will remove any staining of stainless steel from the photoresist. ResiStrip VI gives a small stripped particle size.
-
FlexClean DM™
FlexClean DM is a powerful, non-foaming and free rinsing alkaline cleaner specifically formulated to clean copper on exposed alkalisensitive substrates including polyimide. It will remove oven baked residues, oxidation, fingerprints and oils, all without attack of alkali sensitive substrates or removal of any copper metal. Use of FlexClean DM will leave the copper surface bright, oxidation-free and ready for photoresist application or oxide process. FlexClean DM may be used in conjunction with an acid cleaner, or if required, a light microetch. If a microetch is used, much lower levels of metal are fully acceptable thus minimizing costs and reject rate.
