Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.

Developer Defoamer is a fully organic, non-silicone,water soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essentialand it works at any pH. It is odor-free and biodegradable.