Aqua Flo
An organic, water soluble fusing fluid custom blended for use in tin/lead infrared fusing equipment. AQUA FLOcontains activators which clean exposed copper, providing excellent edge coverage.
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ADF-35
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
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ResiStrip™ PC
ResiStrip PCis designed to strip photoresist quickly and economically operating at low pH. It will tend to give smaller particle sizes.
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PreLam™ Cleaner S
PreLam Cleaner is a cleaner/microetch/adhesion promoter for use on copper and other metals. It will give optimal resist adhesion both initially and during subsequent processing, where other chemicals can weaken the bond at the copper/photoresist interface. PreLam Cleaner S yields a non-traditional looking panel with a bright orange color rather than a more typical matte pink.
