ResiStrip™ 5000
ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.
ResiStrip 5000 is designed to strip difficult to remove photoresists and LDI films quickly, thoroughly and economically. The stripped board is oxidation-free and ready for oxide or etching.
A one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle, eliminating the need to weigh and dissolve powdered materials. It contains a unique blend of ingredients to enhance the loading capacity of the solution and help keep the equipment clean. These special ingredients help ensure straight sidewalls and will help clean the foot” of underdeveloped polymer. These features result in greater productivity and less down time. DX-40 also works well for developing aqueous photoimageable solder masks or for any other situation where carbonate is used. “” one-part concentrate (40% potassium carbonate) formulated to develop fully aqueous dry film photoresists. DX-40 is economical to use and easy to handle
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
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