ADF-35
Formulated to remove fully aqueous dry films and screen ink resists from inner layers in spray applications. ADF-35will produce large particles for easy filtration, with less dissolved resist for prolonged bath life. It contains antitarnish agents to maintain a bright uniform copper appearance. It has very low levels of ingredients classified as VOCs, and when used as directed is exempt from SCAQMDregulation.
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ResiStrip™ CM
ResiStrip CM is designed to satisfy the chemical milling industry’s requirements for a fast and cost effective stripper for copper, Alloy 42 and stainless steel. It will leave copper in a bright tarnish-free condition and will remove any staining of stainless steel from the photoresist. It also gives a small stripped particle size.
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Sur Clean™ 92
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
