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Sodium Persulfate
SODIUM PERSULFATE
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Solder Conditioner II™
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
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Sur Clean™ 92
An acid, sprayable cleaner and microetch. SUR CLEAN 92 removes a minute portion of metallic copper in addition to oxides and organic contamination. It can be used for cleaning inner layers, prior to solder mask application for SMOBC, and prior to solder leveling. It is effective in both spray and soak applications.
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Ultrastrip BAT
A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresists. It can be used on both inner and outer layers and produces large particles suitable for filtration. ULTRASTRIP contains copper brightening agents to provide a bright, uniform surface. It contains NO glycol ether solvents for a safer working environment.ULTRASTRIP BAT contains antitarnish agents which preserve the copper surface for automatic optical inspection and better etching characteristics.
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