Sodium Persulfate
Related products
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ME 515L
A liquid persulfate-based copper microetch that is pre-mixed with sulfuric acid. ME 515L removes copper uniformly, providing good topography for subsequent processing. It can be used wherever a microetch is needed; prior to plating, resist lamination, solder mask over bare copper application, or solder leveling. ME 515L can be used in either soak or spray applications.
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Solder Conditioner II™
Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.
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Ultrastrip BAT
A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresists. It can be used on both inner and outer layers and produces large particles suitable for filtration. ULTRASTRIP contains copper brightening agents to provide a bright, uniform surface. It contains NO glycol ether solvents for a safer working environment.ULTRASTRIP BAT contains antitarnish agents which preserve the copper surface for automatic optical inspection and better etching characteristics.
