Solder Conditioner IITMis a concentrated solutionformulated to clean tin and tin/lead deposits on printed circuit boards. Solder Conditioner IITMremoves oxides caused by copper etchants but will not etch copper or tin/lead deposits. Printed circuit boards treated with Solder Conditioner IITMhave exceptional solderability and will reflow readily.Treated boards may go directly to reflow or into immersion tin prior to reflow. Solder Conditioner IITMcan replace immersion tin in certain applications.

A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.