Magnum N-499 Peroxide
Magnum N-499 Peroxide is a stabilized 25% hydrogen peroxide solution. It is designed for use in preparation and replenishment of Magnum N-499.
Download Data Sheets
Download Data Sheets
Magnum N-499 Peroxide is a stabilized 25% hydrogen peroxide solution. It is designed for use in preparation and replenishment of Magnum N-499.
Defoamer FETM is a fully organic non-Silicone water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odorfree and biodegradable. Defoamer FETM is ideal for defoaming developers or strippers of any type and will work at any pH.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
Provides an effective clean out of Cupric Etcher sumps along with manual removal of deposits on the etch chamber walls. CUPRIC ETCH EQUIPMENT CLEANER will dissolve Dry Film deposits built up between PM’s. CUPRIC ETCH EQUIPMENT CLEANER has a low VOC content for reduced air emissions.
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