MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
A copper plating additive for acid sulfate plating baths designed specifically for high throwing power through-hole plating of printed circuit boards. CuBrite PC-525 produces bright copper deposits that provide consistent thermal stress performance. CuBrite PC-525 is a single, clear addition agent, added on an ampere hour basis, which is used to control the brightness and physical properties of the deposit. The extreme stability of this additive greatly reduces the need for routine solution purification.
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
Ferric Defoamer is a fully organic, non-silicone, water-soluble defoamer that rinses readily and leaves no residue. It is designed for systems where clean rinsing is essential. It is odor-free and biodegradable. Ferric Defoamer is ideal for defoaming ferric chloride and ferric nitrate etchants. Ferric Defoamer is a powerful but application specific defoamer, which works well only at certain temperatures and in concentrated etchants.
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