MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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MicroClean™ CM
MicroClean™ CM is a “micro-cleaner” that is designed to remove extremely tenacious soils from copper, iron, iron-nickel and iron-nickel-chrome alloys. MicroClean™ CM was created to meet the needs of the Chemical Milling Industry. It can remove even baked-on organic compounds, such as may be found on sheets of Alloy 42, stainless steels or copper as they are received or after stripping baked-on photoresist.
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MicroClean™ CuL
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