MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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LevelCote™ Flux 350
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
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Ferric Chloride 42 BE
Ferric Chloride Solution is acidic and should be handled only with appropriate safety equipment including goggles, gloves and protective clothing. Follow standard laboratory practices. Consult Safety Data Sheet for further information. Used solutions contain metal ions and may require treatment before spent solutions are disposed. Dispose of in accordance with federal, state and local regulations. Contact your RBP representative for further information.Clear to slightly hazy, dark red-brown liquid with a sharp odor.
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ChemPolish™ ET
ChemPolish ET (RDX-1096)is an acidic bath used for polishing and passivating 300 series (austenitic) stainless steel as well as other alloys such as Alloy 42 (Kovar). Chemically polished surfaces are suitable for use in extreme environments including high vacuum, medical and aerospace applications. ChemPolish ET (RDX-1096)leaves a clean finish, free of etching,hydrogen embrittlement or halide induced stress cracking. Metal is removed preferentially from high points resulting in a smoother, more leveled surface. The surface is cleaned completely of any organic contamination and is free of soluble inorganic residues.
