MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN CR also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN CR’s non-chelating, non-chloride formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
A wipe-off screen cleaner formulated to rapidly remove inks from printed circuit screens and boards without leaving a residue. EV SCREEN CLEANER has a high evaporation rate to make screens ready for use quickly and without the need for a water rinse.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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