AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and

copper alloys. It reacts chemically with clean copper surfaces to form an invisible barrier

that resists handling and environmental effects. AT-3000 can be used after electroless

copper, prior to photoresist application, and in the SMOBC process. It also can be used as

an additive to photoresist stripping solutions to prevent copper oxidation. When used

following electroless copper deposition, AT-3000 enhances the adhesion of dry film


Download Data Sheets

Download Data Sheets
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