Step Eight

  • AT-2000

    An oxidation inhibitor concentrate which is added to water to prevent tarnishing of copper and copper alloys. AT-2000reacts chemically with clean copper surfaces to form an invisible barrier that resists handling and environmental effects. AT-2000can be used prior to resist application, after electroless copper, and in the SMOBC process.

  • AT-3000

    AT-3000 is a concentrated antitarnish compound which prevents tarnishing of copper and
    copper alloys. It reacts chemically with clean copper surfaces to form an invisible barrier
    that resists handling and environmental effects. AT-3000 can be used after electroless
    copper, prior to photoresist application, and in the SMOBC process. It also can be used as
    an additive to photoresist stripping solutions to prevent copper oxidation. When used
    following electroless copper deposition, AT-3000 enhances the adhesion of dry film
    photoresists.

  • Circutek C-877

    Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.

  • Circutek EC-807

    Circutek C-877 is used to catalyze non-metallic surfaces in the electroless copper process. Such surfaces are present in drilled holes (PTH) and include resin and glass weave surfaces that were cleaned and exposed in the desmear process steps. The chemical activity relies on the presence of colloidal palladium, which when adsorbed on non-metallic surfaces enables plating of electroless copper deposits. Circutek C-877 bath must be preceded by Circutek PD-776 to protect the delicate chemical balance of the former and assure the optimal catalyst performance.