MagnaBond™ 400

SKU: N3209, N3210 Categories: , Tag:

Magnabond 400 is an oxide alternative process that prepares copper surfaces for lamination by forming a copper-organic layer that optimizes the surface for resin adhesion. It is a sulfuric/peroxide chemistry supplied in two concentrated components. Magnabond 400 offers several benefits over conventional oxide and competitive oxide alternatives, namely superior adhesion performance at low cost of operation and ease of control.

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