RBP Chemical Technology is a leader in lamination chemistry for printed circuit board manufacturing.
Browse the table below to learn more about our lamination chemicals.
|MagnaBond™ 400||Copper Surface Prep||Magnabond 400 is an oxide alternative process that prepares copper surfaces for lamination by forming …||lamination electronics-chemicals|
|Ultraclean™ NF||Alkaline cleaner for spray applications||Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the …||copper-cleaning lamination electronics-chemicals|
|PrepBond™||Alkaline cleaner||An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete …||copper-cleaning lamination electronics-chemicals|
|Quantum Etch™||Microetchant for copper||A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM …||lamination electronics-chemicals|
|MagnaBond™ CO-300||Copper Oxide Process||A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from …||lamination electronics-chemicals|