RBP Chemical Technology is a leader in lamination chemistry for printed circuit board manufacturing.
Browse the table below to learn more about our lamination chemicals.
| Product | Description | Details | Base Metal | product_cat_hfilter |
|---|---|---|---|---|
| MagnaBond™ 400 | Copper Surface Prep | Magnabond 400 is an oxide alternative process that prepares copper surfaces for lamination by forming … | lamination electronics-chemicals | |
| Ultraclean™ NF | Alkaline cleaner for spray applications | Formulated to remove dirt, oil, fingerprints and other soils from copper surfaces without etching the … | copper-cleaning lamination electronics-chemicals | |
| PrepBond™ | Alkaline cleaner | An alkaline cleaner for use in the LAYERBOND 2000 adhesion promoter process. PREPBOND provides complete … | copper-cleaning lamination electronics-chemicals | |
| Quantum Etch™ | Microetchant for copper | A stabilized peroxide product for use with sulfuric acid to form a peroxide/sulfuric microetch. QUANTUM … | lamination electronics-chemicals | |
| MagnaBond™ CO-300 | Copper Oxide Process | A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from … | lamination electronics-chemicals |