PCB Webcasts Series: Take 5

Join RBP’s Vice President of Technology, Mike Carano, for these bi-weekly on-demand webcast. In this series we troubleshoot common PCB manufacturing problems and issues. Each webcast is under 15 minutes long. Subscribe to our email list to be notified when new episodes are available.

 

Trouble in Your Tank


Take 5 Webcast

  1. The Evolution of OSP Technology
  2. How Does it Coat and Protect?
  3. Thin vs Thick OSP Coatings
  4. Soldering Process
  5. Surface Prep
  6. Process Control/Microetching
  7. Actionable Items
Access Recording

The Levels of Hyper-Corrosion in ENIG

Levels of Hyper Corrosion in ENIG

  1. What Do We Mean By Corrosion Levels?
  2. Corrosion Levels in Electroless Nickel
  3. What Do We Do With This?
  4. Implemented Improvements and Benefits
  5. Future Improvements and Benefits



Access Recording

The Dreaded Wedge Void


The Dreaded Wedge Void

  1. What are some common wedge defects?
  2. Tale of Two Holes
  3. What is Void Cracking?
  4. Void Crack Examples
  5. Blow Holes and Wedge Voids
  6. Actionable Items


Access Recording

Surface Prep


Surface Prep

  1. Surface prep and photoresist adhesion
  2. The inner layer treatment process
  3. Copper topography and contact area
  4. The ideal surface
  5. Key performance indicators
  6. Surface contaminants
  7. Subtractive process limitations
  8. What to avoid
  9. Foil depressions/ micro scratches
Access Recording

Pitting


Pitting

  1. Common plating defects
  2. Copper to copper peeling
  3. Pitting
  4. Organic plating pits
  5. Bubble plating pits
  6. Gas/air bubble pit
  7. Case studies


Access Recording

Defects and Anomalies


Defects and Anomalies

  1. Negative Etchback
  2. Roughness and Plating Nodules
  3. Residue/Cleaning Issues
  4. Strings/Stringy Nodules





Access Recording
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