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MagnaBond™ 400
Magnabond 400 is an oxide alternative process that prepares copper surfaces for lamination by forming a copper-organic layer that optimizes the surface for resin adhesion. It is a sulfuric/peroxide chemistry supplied in two concentrated components. Magnabond 400 offers several benefits over conventional oxide and competitive oxide alternatives, namely superior adhesion performance at low cost of operation and ease of control.
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MagnaBond™ CO-300
A copper oxide process uniquely formulated to produce a variety of oxide coatings ranging from a very fine-grained bronzed oxide to a larger grained black oxide. MAGNABOND CO-300 provides the flexibility to manipulate the grain size allowing for processing a wide variety of dielectric materials while maintaining optimum inner-layer bonding.
