Rinse Aide™ 95
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
Download Data Sheets
Download Data Sheets
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
A silicone free, non-solvent based aqueous antifoam for primary image developers and strippers and solder mask developers. FoamFREE™ONE suppresses foaming at very low usage without leaving residue behind or in the machine. FoamFREE™ONE is for any manufacturer who needs to reduce antifoam usage to reduce process costs without the use of solvents
A non-ammoniated fluoride glass etch. MAGNUM GE-600 is used to etch away the glass fiber bundles left exposed after the permanganate etchback process. It can be mixed with MAGNUM N-599 NEUTRALIZER or used as a separate step for maximum process control.
An acid, non-etching cleaner that provides the most effective removal of chromate conversion coating from copper laminate. LAYER CLEAN NP also removes soils such as fingerprints and oxides. Used prior to photoresist lamination, it reduces imaging defects by improving photoresist adhesion. LAYER CLEAN NP’s non-chelating, non-chloride, phosphate free formula cleans and conditions copper surfaces, and provides consistent high speed cleaning at low concentrations. It is effective in both spray and soak applications.
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