Rinse Aide™ 95
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
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Download Data Sheets
Formulated for removing insoluble flux residues and ionic contaminants from printed circuit boards following leveling or fusing. RINSE AIDE 95 is designed to be used in spray equipment.
LEVELCOTE FLUX 350 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. It will remove light copper oxides and lays down a protective layer of flux to protect solder mask, and promote good solderability of copper pads. LEVELCOTE FLUX 350 will provide a bright uniform solder finish with good rinseability. LEVELCOTE FLUX 350 is non-foaming and compatible with LPI and dry film solder masks.
Equipment Cleaner II removes water hardness, photoresist and soldermask scum and metal salt deposits from chemical processing equipment. Specifically developed for the Printed Circuit Board and Chemical Milling Industries, it will safely clean any spray equipment without damage to any metal or plastic. Equipment Cleaner II may be used at any temperature the equipment can safely handle, and may be reused until all the capacity is consumed. Equipment Cleaner II is a product that cleans: • Dry film developer residues • Dry film stripper residues • Solder stripper residues • Cleaner residues • Etcher residues (ammoniacal, or cupric) • Soldermask Developer residue • Tin Stripper Iron residue
FLO RITE 60 is a unique blend of ingredients for use in a horizontal and vertical hot air leveling process. FLO RITE 60 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. FLO RITE 60 will provide a bright uniform finish with good rinsability. FLO RITE 60 is a solvent free, non-foaming flux that is compatible with LPI and dry film soldermasks.
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