In-Process Defoamer™
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Circutek C-777
Low acid activator system used to catalyze non-metallic surfaces for the subsequent metallization by electroless copper. CIRCUTEK C-777is primarily used in the fabrication of printed circuit boards but can also be used in any application where the metallization of a non-conductor is desired.A pre-dip solution is necessary to pre condition the substrate and to minimize drag-in of water into the CIRCUTEK C-777. Make up the pre-dip solution according to instructions below, or use CIRCUITEK PD-776 liquid.CIRCUTEK PD-776Sis also used in the preparation of CIRCUTEK C-777.
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Ultrastrip BAT
A highly concentrated, long lasting, high performance non-caustic stripper for removal of aqueous dry film photoresists. It can be used on both inner and outer layers and produces large particles suitable for filtration. ULTRASTRIP contains copper brightening agents to provide a bright, uniform surface. It contains NO glycol ether solvents for a safer working environment.ULTRASTRIP BAT contains antitarnish agents which preserve the copper surface for automatic optical inspection and better etching characteristics.
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ADF-25
Formulated for outstanding performance on today’s newest dry film resists in spray or soak applications. ADF-25breaks dry films into particles suitable for filtration. It also protects the panels from staining caused by dyes in the photoresist. ADF-25demonstrates consistently high loading capabilities, and contains an enhanced copper brightening and antitarnish package. This enables it to produce a bright, uniform copper surface for automatic optical inspection and better etching characteristics.
