In-Process Defoamer™
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DX™45
A one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photoresists and photoimageable solder masks. DX-45’s highly concentrated formula is ideally suited for use in feed and bleed systems, resulting in less frequent additions than with more dilute carbonate solutions. Proprietary ingredients enhance loading, help keep equipment clean, and ensure straighter sidewalls, cleaning the foot” of underdeveloped resist. These features result in greater productivity and less down time. “” one-part concentrate (45% potassium carbonate) formulated to develop fully aqueous dry film photore”
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ResiStrip™ CM
ResiStrip CM is designed to satisfy the chemical milling industry’s requirements for a fast and cost effective stripper for copper, Alloy 42 and stainless steel. It will leave copper in a bright tarnish-free condition and will remove any staining of stainless steel from the photoresist. It also gives a small stripped particle size.
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ADF-30
A photoresist stripper formulated to remove a wide variety of aqueous photoresists. ADF-30provides fast strip speeds and contains brightening and antitarnish agents for a uniform copper surface for automatic optical inspection and better etching characteristics. It produces filterable particles and contains no glycol ethers for a safer working environment. Effective in soak or spray applications.
