MicroClean™ CuLX
MicroClean CuLX is a micro-cleaner that is designed to remove extremely tenacious soils from copper
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Download Data Sheets
MicroClean CuLX is a micro-cleaner that is designed to remove extremely tenacious soils from copper
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
Ferric Cleaner removes water hardness, photoresist scum and metal salt deposits from chemical processing equipment. Specifically developed for the chemical milling industry it is very useful in spray equipment causing no damage to metal and plastic parts. It can be applied in ferric etchers, dry film developers, strippers and cleaner equipment modules.
ElectroClean EChas been used in automated reverse current(anodic) cleaning machines, such as the machine offered by the ChemcutCorporation, but can be used in any automated cleaning process. ElectroClean ECremoves any coatings, organic soils, fingerprints. When cleaning copper, ElectroClean ECis often followed by an acid cleaner, but can be followedby a microetch.This will usually not be necessary when ElectroClean ECis used as an anodic electrocleaner.ElectroClean ECcan be used for cleaningcopper, iron and stainless steel.Machine clean-out is facilitated as sludging is negligible. Solution life is monitored by checking metal content. Change out working solution when sludging is observed, or metal content exceeds 5 grams per liter.
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