MicroClean™ CuL
MicroClean CuL is a micro-cleaner that is designed to remove extremely tenacious soils from copper
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MicroClean™ S
MicroClean S is a low foam cleaner for removing fingerprints, chromate and oxide residues from copper and other metal foils prior to photoresist lamination or oxide.
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Ferric Chloride 42 BE
Ferric Chloride Solution is acidic and should be handled only with appropriate safety equipment including goggles, gloves and protective clothing. Follow standard laboratory practices. Consult Safety Data Sheet for further information. Used solutions contain metal ions and may require treatment before spent solutions are disposed. Dispose of in accordance with federal, state and local regulations. Contact your RBP representative for further information.Clear to slightly hazy, dark red-brown liquid with a sharp odor.
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ElectroClean™ EC (RD-44)
ElectroClean EChas been used in automated reverse current(anodic) cleaning machines, such as the machine offered by the ChemcutCorporation, but can be used in any automated cleaning process. ElectroClean ECremoves any coatings, organic soils, fingerprints. When cleaning copper, ElectroClean ECis often followed by an acid cleaner, but can be followedby a microetch.This will usually not be necessary when ElectroClean ECis used as an anodic electrocleaner.ElectroClean ECcan be used for cleaningcopper, iron and stainless steel.Machine clean-out is facilitated as sludging is negligible. Solution life is monitored by checking metal content. Change out working solution when sludging is observed, or metal content exceeds 5 grams per liter.
